EPF10K200SFI672-2 vs EPF10K200SFI672-2N Comparison
Detailed side-by-side comparison of EPF10K200SFI672-2 by Intel and EPF10K200SFI672-2N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EPF10K200SFI672-2 | EPF10K200SFI672-2N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Obsolete |
| Family | FLEX 10KE | FLEX 10KE |
| Logic Elements | 9984 | — |
| System Gates | 200000 | — |
| Logic Array Blocks (LABs) | 1248 | — |
| User I/Os | 470 | 470 |
| Embedded Array Blocks (EABs) | 24 | — |
| Embedded Memory (EAB SRAM) | 96 Kbit | — |
| Distributed Memory | 98304 bits | — |
| Process Technology | 0.22 µm (Arrow lists 0.42 µm) | 0.22 um CMOS |
| Core Supply Voltage | 2.5 V | 2.5 V |
| Package | 672-pin FineLine BGA (FBGA) | 672-ball FBGA (FineLine BGA), 27 x 27 mm, 1.0 mm pitch |
| Speed Grade | -2 | -2 (mid) |
| Operating Temperature | Industrial (-40C to +85C) | — |
| JTAG Boundary Scan | IEEE Std. 1149.1-1990 compliant | — |
| PCI Compliance | PCI Local Bus Specification Rev 2.2 (3.3 V, 33/66 MHz) on -1 speed grade | — |
| Programming | SRAM-based, in-system programmable | — |
| RoHS Status | Not compliant (per Arrow EU RoHS listing) | Lead-free (N suffix) |
| Device Logic Elements | — | 9,984 |
| Typical Gates | — | 200,000 |
| Maximum System Gates | — | [DATA_NEEDED: maximum system gates] |
| Embedded Memory (EAB) | — | 12 EABs, 98,304 bits total |
| I/O Supply Voltage | — | 3.3 V (5.0 V tolerant) |
| Operating Temperature Grade | — | Industrial (-40C to +85C) |
| Mounting Type | — | Surface Mount |
| JTAG Boundary-Scan | — | IEEE Std. 1149.1 compliant |
| Configuration Method | — | SRAM-based (requires external boot ROM) |