EPF10K200SFI672-2 vs EPF10K200SFI672-2N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K200SFI672-2 sa pamamagitan ng Intel at EPF10K200SFI672-2N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EPF10K200SFI672-2 EPF10K200SFI672-2N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete Obsolete
Family FLEX 10KE FLEX 10KE
Logic Elements 9984 —
System Gates 200000 —
Logic Array Blocks (LABs) 1248 —
User I/Os 470 470
Embedded Array Blocks (EABs) 24 —
Embedded Memory (EAB SRAM) 96 Kbit —
Distributed Memory 98304 bits —
Process Technology 0.22 µm (Arrow lists 0.42 µm) 0.22 um CMOS
Core Supply Voltage 2.5 V 2.5 V
Packhaging 672-pin FineLine BGA (FBGA) 672-ball FBGA (FineLine BGA), 27 x 27 mm, 1.0 mm pitch
Speed Grade -2 -2 (mid)
Temperature na Operasyon Industrial (-40C to +85C) —
JTAG Boundary Scan IEEE Std. 1149.1-1990 compliant —
PCI Compliance PCI Local Bus Specification Rev 2.2 (3.3 V, 33/66 MHz) on -1 speed grade —
Programming SRAM-based, in-system programmable —
Tindminan RoHS Not compliant (per Arrow EU RoHS listing) Lead-free (N suffix)
Device Logic Elements — 9,984
Typical Gates — 200,000
Maximum System Gates — [DATA_NEEDED: maximum system gates]
Embedded Memory (EAB) — 12 EABs, 98,304 bits total
I/O Supply Voltage — 3.3 V (5.0 V tolerant)
Operating Temperature Grade — Industrial (-40C to +85C)
Uri ng Pagpapasok — Surface Mount
JTAG Boundary-Scan — IEEE Std. 1149.1 compliant
Configuration Method — SRAM-based (requires external boot ROM)

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