EPF10K250EBC600-1 vs EPF10K250EBI600-3 Comparison
Detailed side-by-side comparison of EPF10K250EBC600-1 by Intel and EPF10K250EBI600-3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EPF10K250EBI600-3 - 250K Gates FLEX 10KE FPGA, 600-BGA | Intel
EPF10K250EBI600-3 β Last Time BuySpecification Comparison
| Parameter | EPF10K250EBC600-1 | EPF10K250EBI600-3 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Last_time_buy |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $155.00 | $110.00 |
| Manufacturer | Intel / Altera | β |
| Family | FLEX 10KE | FLEX 10KE |
| Logic Elements | 12,160 | 12,160 |
| Typical Gates | 250,000 | β |
| Usable Gates | 110,000 | β |
| Embedded Array Blocks (EABs) | 6 | β |
| Maximum RAM Bits | 40,960 | β |
| Number of PLLs | 6 | β |
| Core Voltage | 5.0 V | 2.3 V (FLEX 10KE standard) [DATA_NEEDED: confirm exact VCCINT] |
| Operating Temperature | 0Β°C to +70Β°C (Commercial) | Industrial, 0C to +85C [DATA_NEEDED: confirm -40C to +85C range] |
| Process Technology | 0.22 Β΅m SRAM | 0.22 Β΅m CMOS, 4-layer metal |
| Package | 600-BGA FineLine BGA | 600-ball BGA (HBGA) |
| Speed Grade | -1 | -3 (fastest) |
| Configuration Method | JTAG / ByteBlaster / EPC-series PROM | SRAM, requires external configuration device (EPC series) |
| RoHS Status | [DATA_NEEDED: RoHS status] | Not specified (SnPb / tin-lead finish per legacy distributor listing) |
| Programmable I/O Voltage | 3.3 V / 5.0 V (MultiVolt I/O) | β |
| Typical Gate Count | β | 250,000 system gates |
| Embedded System Blocks (ESBs) | β | 12 |
| Maximum User I/O | β | 470 |
| Dedicated Inputs | β | 4 |
| PLLs | β | 4 |
| On-chip RAM | β | Up to 40 Kbits |
| Ball Pitch | β | 1.93 mm |
| Mounting Type | β | Surface Mount |
| Lead-free | β | no (legacy tin-lead per distributor description) |