EPF10K250EBC600-1 vs EPF10K250EBI600-3 Perbandingan
Perbandingan bersamaan detil EPF10K250EBC600-1 dari Intel dan EPF10K250EBI600-3 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Intel
EPF10K250EBI600-3 - 250K Gates FLEX 10KE FPGA, 600-BGA | Intel
EPF10K250EBI600-3 ⚠ Waktu Beli TerakhirPerbandingan Spesifikasi
| Parameter Umum | EPF10K250EBC600-1 | EPF10K250EBI600-3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Waktu Pembelian Terakhir |
| Manufacturer | Intel / Altera | — |
| Family | FLEX 10KE | FLEX 10KE |
| Logic Elements | 12,160 | 12,160 |
| Typical Gates | 250,000 | — |
| Usable Gates | 110,000 | — |
| Embedded Array Blocks (EABs) | 6 | — |
| Maximum RAM Bits | 40,960 | — |
| Number of PLLs | 6 | — |
| Core Voltage | 5.0 V | 2.3 V (FLEX 10KE standard) [DATA_NEEDED: confirm exact VCCINT] |
| Suhu Kerja | 0°C to +70°C (Commercial) | Industrial, 0C to +85C [DATA_NEEDED: confirm -40C to +85C range] |
| Process Technology | 0.22 µm SRAM | 0.22 µm CMOS, 4-layer metal |
| Paket | 600-BGA FineLine BGA | 600-ball BGA (HBGA) |
| Speed Grade | -1 | -3 (fastest) |
| Configuration Method | JTAG / ByteBlaster / EPC-series PROM | SRAM, requires external configuration device (EPC series) |
| Status RoHS | [DATA_NEEDED: RoHS status] | Not specified (SnPb / tin-lead finish per legacy distributor listing) |
| Programmable I/O Voltage | 3.3 V / 5.0 V (MultiVolt I/O) | — |
| Typical Gate Count | — | 250,000 system gates |
| Embedded System Blocks (ESBs) | — | 12 |
| Maximum User I/O | — | 470 |
| Dedicated Inputs | — | 4 |
| PLLs | — | 4 |
| On-chip RAM | — | Up to 40 Kbits |
| Ball Pitch | — | 1.93 mm |
| Tipe Mounting | — | Surface Mount |
| Lead-free | — | no (legacy tin-lead per distributor description) |