EPF10K250EBC600-3 vs EPF10K200EBC600-3 Comparison
Detailed side-by-side comparison of EPF10K250EBC600-3 by Intel and EPF10K200EBC600-3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EPF10K200EBC600-3 - 200K Gate FLEX 10KE FPGA, 600-BGA | Intel / Altera
EPF10K200EBC600-3 ObsoleteSpecification Comparison
| Parameter | EPF10K250EBC600-3 | EPF10K200EBC600-3 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Obsolete |
| Family | FLEX 10KE | FLEX 10KE |
| Logic Elements | 12,160 LEs | — |
| Typical Gates | 250,000 | — |
| Maximum User I/O | 470 | 470 |
| Embedded Array Blocks (EABs) | 12 (each 2 Kbits) | — |
| Total Embedded Memory | 24 Kbits (RAM) | — |
| PLLs (Phase-Locked Loops) | 4 | — |
| Dedicated Clock Inputs | 6 | — |
| Speed Grade | -3 | -3 (commercial) |
| Core Supply Voltage | 3.3 V | — |
| I/O Supply Voltage | 3.3 V (5 V tolerant) | — |
| Package | 600-ball FineLine BGA | 600-ball FineLine BGA, 45 x 45 mm |
| Configuration Mode | Passive Serial / Passive Parallel / JTAG | — |
| Boundary Scan | IEEE 1149.1 (JTAG) | — |
| Operating Temperature | [DATA_NEEDED: operating temperature range] | 0C to +70C (commercial) |
| Process Technology | SRAM-based CMOS | 0.22 micrometer SRAM |
| Series | — | FLEX-10KE |
| System Gates | — | 200,000 |
| Logic Elements / Cells | — | 9,984 |
| Logic Array Blocks (LABs) | — | 1248 |
| Embedded Memory (EABs) | — | 24,576 bits |
| Number of PLLs | — | 4 |
| Core Voltage | — | 2.5 V (2.375 V to 2.625 V) |
| Mounting Type | — | Surface Mount |
| JTAG Support | — | Yes (IEEE 1149.1 boundary-scan) |
| RoHS Status | — | [DATA_NEEDED: RoHS compliance status] |