EPF10K250EBC600-3 vs EPF10K200EBC600-3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K250EBC600-3 sa pamamagitan ng Intel at EPF10K200EBC600-3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EPF10K200EBC600-3 - 200K Gate FLEX 10KE FPGA, 600-BGA | Intel / Altera
EPF10K200EBC600-3 ObsoletePagsanggunian na paghahambing
| Parametro | EPF10K250EBC600-3 | EPF10K200EBC600-3 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Family | FLEX 10KE | FLEX 10KE |
| Logic Elements | 12,160 LEs | — |
| Typical Gates | 250,000 | — |
| Maximum User I/O | 470 | 470 |
| Embedded Array Blocks (EABs) | 12 (each 2 Kbits) | — |
| Total Embedded Memory | 24 Kbits (RAM) | — |
| PLLs (Phase-Locked Loops) | 4 | — |
| Dedicated Clock Inputs | 6 | — |
| Speed Grade | -3 | -3 (commercial) |
| Core Supply Voltage | 3.3 V | — |
| I/O Supply Voltage | 3.3 V (5 V tolerant) | — |
| Packhaging | 600-ball FineLine BGA | 600-ball FineLine BGA, 45 x 45 mm |
| Configuration Mode | Passive Serial / Passive Parallel / JTAG | — |
| Boundary Scan | IEEE 1149.1 (JTAG) | — |
| Temperature na Operasyon | [DATA_NEEDED: operating temperature range] | 0C to +70C (commercial) |
| Process Technology | SRAM-based CMOS | 0.22 micrometer SRAM |
| Series | — | FLEX-10KE |
| System Gates | — | 200,000 |
| Logic Elements / Cells | — | 9,984 |
| Logic Array Blocks (LABs) | — | 1248 |
| Embedded Memory (EABs) | — | 24,576 bits |
| Number of PLLs | — | 4 |
| Core Voltage | — | 2.5 V (2.375 V to 2.625 V) |
| Uri ng Pagpapasok | — | Surface Mount |
| JTAG Support | — | Yes (IEEE 1149.1 boundary-scan) |
| Tindminan RoHS | — | [DATA_NEEDED: RoHS compliance status] |