EPF10K250EBC600-3 vs EPF10K200SBC600-1 Comparison

Detailed side-by-side comparison of EPF10K250EBC600-3 by Intel and EPF10K200SBC600-1 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K250EBC600-3 EPF10K200SBC600-1
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $205.00 $425.00
Family FLEX 10KE FLEX-10KS
Logic Elements 12,160 LEs β€”
Typical Gates 250,000 β€”
Maximum User I/O 470 β€”
Embedded Array Blocks (EABs) 12 (each 2 Kbits) β€”
Total Embedded Memory 24 Kbits (RAM) β€”
PLLs (Phase-Locked Loops) 4 β€”
Dedicated Clock Inputs 6 β€”
Speed Grade -3 -1 (fastest commercial)
Core Supply Voltage 3.3 V β€”
I/O Supply Voltage 3.3 V (5 V tolerant) β€”
Package 600-ball FineLine BGA 600-ball BGA, 45 Γ— 45 mm, 1.27 mm pitch
Configuration Mode Passive Serial / Passive Parallel / JTAG β€”
Boundary Scan IEEE 1149.1 (JTAG) β€”
Operating Temperature [DATA_NEEDED: operating temperature range] 0 Β°C to 70 Β°C (Commercial)
Process Technology SRAM-based CMOS 0.22 Β΅m CMOS
Series β€” EPF10K200
Logic Elements / Cells β€” 9,984
Gate Count (typical) β€” 200,000 gates
Logic Array Blocks (LABs) β€” 1,248
Number of User I/Os β€” 470
Number of Logic Cells β€” 4,992
Embedded RAM (bits) β€” 24,576 (across EABs)
Max Internal Frequency β€” 250 MHz
Propagation Delay β€” 0.4 ns
Core Supply Voltage (VCCINT) β€” 2.375 V to 2.625 V (typ. 2.5 V)
Mounting Type β€” Surface Mount
JTAG Support β€” IEEE Std 1149.1
Configuration β€” Serial via EPC2/EPC8 configuration devices
RoHS Status β€” Non-compliant (per third-party listing)

Datasheets & Resources

Browse All Products Create BOM Request Quote