EPF10K250EBC600-3 vs EPF10K200SBC600-1 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K250EBC600-3 sa pamamagitan ng Intel at EPF10K200SBC600-1 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EPF10K250EBC600-3 EPF10K200SBC600-1
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete Obsolete
Family FLEX 10KE FLEX-10KS
Logic Elements 12,160 LEs —
Typical Gates 250,000 —
Maximum User I/O 470 —
Embedded Array Blocks (EABs) 12 (each 2 Kbits) —
Total Embedded Memory 24 Kbits (RAM) —
PLLs (Phase-Locked Loops) 4 —
Dedicated Clock Inputs 6 —
Speed Grade -3 -1 (fastest commercial)
Core Supply Voltage 3.3 V —
I/O Supply Voltage 3.3 V (5 V tolerant) —
Packhaging 600-ball FineLine BGA 600-ball BGA, 45 × 45 mm, 1.27 mm pitch
Configuration Mode Passive Serial / Passive Parallel / JTAG —
Boundary Scan IEEE 1149.1 (JTAG) —
Temperature na Operasyon [DATA_NEEDED: operating temperature range] 0 °C to 70 °C (Commercial)
Process Technology SRAM-based CMOS 0.22 µm CMOS
Series — EPF10K200
Logic Elements / Cells — 9,984
Gate Count (typical) — 200,000 gates
Logic Array Blocks (LABs) — 1,248
Number of User I/Os — 470
Number of Logic Cells — 4,992
Embedded RAM (bits) — 24,576 (across EABs)
Max Internal Frequency — 250 MHz
Propagation Delay — 0.4 ns
Core Supply Voltage (VCCINT) — 2.375 V to 2.625 V (typ. 2.5 V)
Uri ng Pagpapasok — Surface Mount
JTAG Support — IEEE Std 1149.1
Configuration — Serial via EPC2/EPC8 configuration devices
Tindminan RoHS — Non-compliant (per third-party listing)

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