EPF10K250EBC600-3 vs EPF10K200SBC600-1 比較

詳細並排比較 EPF10K250EBC600-3 由 Intel 與 EPF10K200SBC600-1 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EPF10K250EBC600-3 EPF10K200SBC600-1
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 Obsolete Obsolete
Family FLEX 10KE FLEX-10KS
Logic Elements 12,160 LEs —
Typical Gates 250,000 —
Maximum User I/O 470 —
Embedded Array Blocks (EABs) 12 (each 2 Kbits) —
Total Embedded Memory 24 Kbits (RAM) —
PLLs (Phase-Locked Loops) 4 —
Dedicated Clock Inputs 6 —
Speed Grade -3 -1 (fastest commercial)
Core Supply Voltage 3.3 V —
I/O Supply Voltage 3.3 V (5 V tolerant) —
封裝 600-ball FineLine BGA 600-ball BGA, 45 × 45 mm, 1.27 mm pitch
Configuration Mode Passive Serial / Passive Parallel / JTAG —
Boundary Scan IEEE 1149.1 (JTAG) —
工作溫度 [DATA_NEEDED: operating temperature range] 0 °C to 70 °C (Commercial)
Process Technology SRAM-based CMOS 0.22 µm CMOS
Series — EPF10K200
Logic Elements / Cells — 9,984
Gate Count (typical) — 200,000 gates
Logic Array Blocks (LABs) — 1,248
Number of User I/Os — 470
Number of Logic Cells — 4,992
Embedded RAM (bits) — 24,576 (across EABs)
Max Internal Frequency — 250 MHz
Propagation Delay — 0.4 ns
Core Supply Voltage (VCCINT) — 2.375 V to 2.625 V (typ. 2.5 V)
安裝類型 — Surface Mount
JTAG Support — IEEE Std 1149.1
Configuration — Serial via EPC2/EPC8 configuration devices
RoHS 狀態 — Non-compliant (per third-party listing)

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