EPF10K250EFC672-1 vs EPF10K200EFC672-2 Comparison
Detailed side-by-side comparison of EPF10K250EFC672-1 by Intel and EPF10K200EFC672-2 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EPF10K250EFC672-1 | EPF10K200EFC672-2 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | NRND |
| Family | FLEX 10KE | FLEX 10KE |
| Logic Family | CMOS | CMOS |
| Typical System Gates | 250,000 | — |
| Maximum User I/Os | 470 | 470 |
| Total Pins | 672 | — |
| Package Type | BGA-672 | — |
| Package Size | 45 x 45 mm | — |
| Ball Pitch | 1.27 mm | 1.27 mm |
| Package Shape | Square | — |
| Terminal Form | Ball | — |
| Operating Temperature | 0C to +70C (Commercial) | 0 C to 70 C |
| Propagation Delay | 0.4 ns | 0.4 ns |
| Programming Technology | In-system, SRAM-based | — |
| RoHS Status | [DATA_NEEDED: RoHS status] | Compliant (per distributor listing) |
| Mounting Type | Surface Mount | — |
| Configuration Interface | Serial (passive/active) | — |
| Speed Grade | -1 | -2 |
| Logic Elements | — | 9,984 |
| Typical Gates | — | 200,000 |
| Embedded Memory | — | 98,304 bits |
| Embedded Array Blocks (EABs) | — | 12 |
| Logic Array Blocks (LABs) | — | 624 |
| Package | — | 672-BBGA (FineLine BGA) |
| Package Dimensions | — | 45 x 45 mm |
| Process Technology | — | 0.22 um CMOS |
| Supply Voltage (Core) | — | [DATA_NEEDED: core Vcc] |
| Programmability | — | JTAG (IEEE 1149.1) / in-system |