EPF10K250EFC672-2 vs EPF10K250EFI672-3 Comparison

Detailed side-by-side comparison of EPF10K250EFC672-2 by Intel and EPF10K250EFI672-3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K250EFC672-2 EPF10K250EFI672-3
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Nrnd Nrnd
Stock Status In Stock In Stock
Unit Price (USD) $108.00 $125.00
Family FLEX 10KE FLEX 10KE
Logic Elements 12,480 [DATA_NEEDED: exact LE count]
Typical Gates 250,000 250,000
Embedded Array Blocks (EABs) 20 12
Maximum User RAM Bits 40,960 β€”
User I/Os 470 β€”
Package 672-BGA (FineLine BGA), 45 x 45 mm, 1.27 mm pitch 672-ball FineLine BGA, 1.27 mm pitch
Pin Count 672 β€”
Propagation Delay 0.4 ns β€”
Operating Temperature 0 C to +70 C (Commercial) 0 Β°C to 70 Β°C (commercial)
Core Supply Voltage 2.3 V (typical 2.5 V) 2.5 V
I/O Standard Support 1.8 V, 2.5 V, 3.3 V (multi-volt I/O) β€”
Logic Family CMOS, SRAM-based β€”
Configuration SRAM, in-system programmable (ISP) via JTAG β€”
Boundary Scan IEEE 1149.1 (JTAG) compliant β€”
Mounting Type Surface Mount β€”
RoHS Status Non-RoHS Compliant (per Fly-Wing listing) Unknown (legacy Altera non-RoHS device)
User I/O Pins β€” 470
EAB Dual-Port Width β€” Up to 16-bit
Maximum EAB Memory β€” [DATA_NEEDED: bits per EAB]
Propagation Delay (tpd) β€” 0.4 ns (typical, -3 speed grade)
I/O Supply Voltage β€” 2.5 V / 3.3 V (multiVolt I/O)
Process Technology β€” CMOS, SRAM-based configuration
Configuration Interface β€” JTAG / ByteBlaster (EPC2/EPC8 PROM)
Design Entry β€” EDIF 2 0 0 / 3 0 0, LPM, VHDL, Verilog

Datasheets & Resources

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