EPF10K250EFC672-2 vs EPF10K250EFI672-3 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K250EFC672-2 sa pamamagitan ng Intel at EPF10K250EFI672-3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EPF10K250EFC672-2 EPF10K250EFI672-3
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle NRND NRND
Family FLEX 10KE FLEX 10KE
Logic Elements 12,480 [DATA_NEEDED: exact LE count]
Typical Gates 250,000 250,000
Embedded Array Blocks (EABs) 20 12
Maximum User RAM Bits 40,960 —
User I/Os 470 —
Packhaging 672-BGA (FineLine BGA), 45 x 45 mm, 1.27 mm pitch 672-ball FineLine BGA, 1.27 mm pitch
Bilang ng Pin 672 —
Propagation Delay 0.4 ns —
Temperature na Operasyon 0 C to +70 C (Commercial) 0 °C to 70 °C (commercial)
Core Supply Voltage 2.3 V (typical 2.5 V) 2.5 V
I/O Standard Support 1.8 V, 2.5 V, 3.3 V (multi-volt I/O) —
Logic Family CMOS, SRAM-based —
Configuration SRAM, in-system programmable (ISP) via JTAG —
Boundary Scan IEEE 1149.1 (JTAG) compliant —
Uri ng Pagpapasok Surface Mount —
Tindminan RoHS Non-RoHS Compliant (per Fly-Wing listing) Unknown (legacy Altera non-RoHS device)
User I/O Pins — 470
EAB Dual-Port Width — Up to 16-bit
Maximum EAB Memory — [DATA_NEEDED: bits per EAB]
Propagation Delay (tpd) — 0.4 ns (typical, -3 speed grade)
I/O Supply Voltage — 2.5 V / 3.3 V (multiVolt I/O)
Process Technology — CMOS, SRAM-based configuration
Configuration Interface — JTAG / ByteBlaster (EPC2/EPC8 PROM)
Design Entry — EDIF 2 0 0 / 3 0 0, LPM, VHDL, Verilog

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