EPF10K250EGC599-1 vs EPF10K200EGC599-3 Comparison

Detailed side-by-side comparison of EPF10K250EGC599-1 by Intel and EPF10K200EGC599-3 by Altera. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Altera
EPF10K200EGC599-3 EPF10K200EGC599-3 - FLEX 10KE 200K FPGA, 599-BCPGA | Altera

EPF10K200EGC599-3 - FLEX 10KE 200K FPGA, 599-BCPGA | Altera

EPF10K200EGC599-3 ⚠ Last Time Buy

Specification Comparison

Parameter EPF10K250EGC599-1 EPF10K200EGC599-3
Brand Intel Altera
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status NRND Last Time Buy
Product Type FPGA (Field-Programmable Gate Array) —
Series FLEX 10K FLEX-10KE
Logic Elements 40,960 9984
Equivalent Gates 250,000 —
Flip-Flops 12,160 —
User I/O Pins 470 —
Embedded Array Blocks (EAB) 20 (2 Kbit each) —
Package 599-BPGA / HIPGA-599 (Ceramic Pin Grid Array) 599-BCPGA (62.48 x 62.48 mm)
Pin Count 599 —
Operating Temperature 0C to +70C (Commercial) —
Mounting Type Through-Hole (PGA) Through Hole (Pin/Peg)
Configuration SRAM (volatile), serial/parallel EPROM —
Process Node 0.42 µm CMOS —
I/O Standard Support 5.0 V PCI, LVTTL, LVCMOS —
Programming Interface JTAG (IEEE 1149.1), passive serial JTAG (IEEE 1149.1)
MSL Level [DATA_NEEDED: moisture sensitivity level] —
RoHS Status unknown (ceramic HIPGA package historically non-RoHS) —
Manufacturer — Altera (Intel)
Family — FLEX 10KE
Device Type — FPGA (Field Programmable Gate Array)
System Gates — 200000 (approx.)
Total RAM Bits — 98304
Maximum User I/O — 470
Number of Terminals — 599
Package Code — PGA (Ceramic Pin Grid Array)
Operating Temperature Grade — Commercial
Core Supply Voltage — 2.375 V to 2.625 V (typical 2.5 V)
Process Technology — 0.22 µm SRAM CMOS
Maximum Frequency — 166.67 MHz
Speed Grade — -3 (0.8 ns)
Propagation Delay — 0.8 ns
Configuration Memory — SRAM-based (volatile)

Datasheets & Resources

Browse All Products Create BOM Request Quote