EPF10K250EGC599-1 vs EPF10K250EGC599-3 Comparison

Detailed side-by-side comparison of EPF10K250EGC599-1 by Intel and EPF10K250EGC599-3 by Altera. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Altera
EPF10K250EGC599-3 EPF10K250EGC599-3 - 250K Gate FLEX 10KE FPGA, 599-PGA | Intel

EPF10K250EGC599-3 - 250K Gate FLEX 10KE FPGA, 599-PGA | Intel

EPF10K250EGC599-3 ⚠ Last Time Buy

Specification Comparison

Parameter EPF10K250EGC599-1 EPF10K250EGC599-3
Brand Intel Altera
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status NRND Last Time Buy
Product Type FPGA (Field-Programmable Gate Array) —
Series FLEX 10K —
Logic Elements 40,960 12,160
Equivalent Gates 250,000 —
Flip-Flops 12,160 —
User I/O Pins 470 —
Embedded Array Blocks (EAB) 20 (2 Kbit each) —
Package 599-BPGA / HIPGA-599 (Ceramic Pin Grid Array) 599-pin PGA (HIPGA / Heat-dissipating PGA)
Pin Count 599 —
Operating Temperature 0C to +70C (Commercial) —
Mounting Type Through-Hole (PGA) Through-hole PGA
Configuration SRAM (volatile), serial/parallel EPROM —
Process Node 0.42 µm CMOS —
I/O Standard Support 5.0 V PCI, LVTTL, LVCMOS —
Programming Interface JTAG (IEEE 1149.1), passive serial —
MSL Level [DATA_NEEDED: moisture sensitivity level] —
RoHS Status unknown (ceramic HIPGA package historically non-RoHS) [DATA_NEEDED: RoHS compliance status]
Family — FLEX 10KE
Typical Gates — 250,000
Embedded Memory (Bits) — 409,600
Embedded Array Blocks (EABs) — 12
Maximum User I/O — 470
Package Pin Count — 599
Speed Grade — -3
Operating Temperature Grade — Commercial (0C to +70C)
Core Voltage — 3.3 V
I/O Voltage Support — 3.3 V / 2.5 V / 1.8 V (MultiVolt)
Process Technology — 0.22 micron CMOS, SRAM-based configuration
Configuration Method — Serial or parallel, SRAM configuration cell
Terminal Form — PIN/PEG

Datasheets & Resources

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