EPF10K30EFC256-2N vs EPF10K30EFC256-1 Comparison
Detailed side-by-side comparison of EPF10K30EFC256-2N by Intel and EPF10K30EFC256-1 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EPF10K30EFC256-2N - FLEX 10KE FPGA 30K Gates 256-BGA | Intel / Altera
EPF10K30EFC256-2N ObsoleteSpecification Comparison
| Parameter | EPF10K30EFC256-2N | EPF10K30EFC256-1 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Obsolete |
| Series | FLEX 10KE | FLEX 10KE |
| Family | FLEX 10KE Embedded Programmable Logic Family | FLEX 10KE |
| Typical Gates | 30,000 | 30,000 |
| Logic Elements (LEs) | 1,728 | — |
| Embedded RAM Bits | 24,576 | — |
| Embedded Array Blocks (EABs) | 6 | — |
| User I/Os | 246 | — |
| Logic Cells | 1728 | — |
| Propagation Delay | 0.6 ns (per digchip listing; internal frequency 80 MHz) | — |
| Number of Logic Elements | 24576 | — |
| Operating Temperature | 0 °C to +70 °C (Commercial) | 0C to +70C (Commercial) |
| Supply Voltage | [DATA_NEEDED: core and I/O rail voltages] | — |
| Process Technology | 0.22 µm CMOS, SRAM-based | 0.22 µm CMOS SRAM |
| Package | 256-ball FineLine BGA (PBGA256), 17 x 17 mm, 1.0 mm pitch | — |
| Mounting Type | Surface Mount | Surface Mount |
| Configuration | Passive Serial / Active Serial / JTAG | — |
| Lead Free / RoHS | Non-RoHS (legacy, SnPb finish per FBGA-256 family) | — |
| Speed Grade | -2N (mid-grade, 0.6 ns) | -1 |
| Logic Elements / Cells | — | 1,728 |
| Total RAM Bits | — | 24,576 |
| Number of I/O | — | 176 |
| Number of Logic Gates | — | 119,000 |
| Voltage - Supply | — | 2.375 V to 2.625 V |
| Package / Case | — | 256-FBGA (17 x 17 mm, 1 mm pitch) |
| Supplier Device Package | — | 256-FBGA |
| RoHS Status | — | Compliant (verify per lot) |