EPF10K30EFC256-2N vs EPF10K30EFC256-1 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K30EFC256-2N sa pamamagitan ng Intel at EPF10K30EFC256-1 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EPF10K30EFC256-2N - FLEX 10KE FPGA 30K Gates 256-BGA | Intel / Altera
EPF10K30EFC256-2N ObsoletePagsanggunian na paghahambing
| Parametro | EPF10K30EFC256-2N | EPF10K30EFC256-1 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Series | FLEX 10KE | FLEX 10KE |
| Family | FLEX 10KE Embedded Programmable Logic Family | FLEX 10KE |
| Typical Gates | 30,000 | 30,000 |
| Logic Elements (LEs) | 1,728 | — |
| Embedded RAM Bits | 24,576 | — |
| Embedded Array Blocks (EABs) | 6 | — |
| User I/Os | 246 | — |
| Logic Cells | 1728 | — |
| Propagation Delay | 0.6 ns (per digchip listing; internal frequency 80 MHz) | — |
| Number of Logic Elements | 24576 | — |
| Temperature na Operasyon | 0 °C to +70 °C (Commercial) | 0C to +70C (Commercial) |
| Volte ng Pagbibigay | [DATA_NEEDED: core and I/O rail voltages] | — |
| Process Technology | 0.22 µm CMOS, SRAM-based | 0.22 µm CMOS SRAM |
| Packhaging | 256-ball FineLine BGA (PBGA256), 17 x 17 mm, 1.0 mm pitch | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Configuration | Passive Serial / Active Serial / JTAG | — |
| Lead Free / RoHS | Non-RoHS (legacy, SnPb finish per FBGA-256 family) | — |
| Speed Grade | -2N (mid-grade, 0.6 ns) | -1 |
| Logic Elements / Cells | — | 1,728 |
| Total RAM Bits | — | 24,576 |
| Number of I/O | — | 176 |
| Number of Logic Gates | — | 119,000 |
| Voltage - Supply | — | 2.375 V to 2.625 V |
| Packhaging / Kaso | — | 256-FBGA (17 x 17 mm, 1 mm pitch) |
| Supplier Device Package | — | 256-FBGA |
| Tindminan RoHS | — | Compliant (verify per lot) |