EPF10K30EFC256-3 vs EPF10K30EFC256-2N Comparison
Detailed side-by-side comparison of EPF10K30EFC256-3 by Intel and EPF10K30EFC256-2N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EPF10K30EFC256-2N - FLEX 10KE FPGA 30K Gates 256-BGA | Intel / Altera
EPF10K30EFC256-2N ObsoleteSpecification Comparison
| Parameter | EPF10K30EFC256-3 | EPF10K30EFC256-2N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Obsolete |
| Family | FLEX 10KE | FLEX 10KE Embedded Programmable Logic Family |
| Typical Gates | 30,000 | 30,000 |
| Logic Elements / Cells | 1,728 | — |
| Logic Array Blocks (LABs) | 216 | — |
| Embedded RAM Bits | 24,576 | 24,576 |
| User I/O Pins | 176 | — |
| Maximum Operating Frequency | 200 MHz | — |
| Process Technology | 0.22 micrometer CMOS | 0.22 µm CMOS, SRAM-based |
| Core Supply Voltage (VCCINT) | 2.5 V | — |
| I/O Supply Voltage (VCCIO) | 3.3 V (multi-voltage I/O standard support) | — |
| Package | 256-ball FineLine BGA | 256-ball FineLine BGA (PBGA256), 17 x 17 mm, 1.0 mm pitch |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| Speed Grade | -3 (fastest) | -2N (mid-grade, 0.6 ns) |
| Temperature Grade | Commercial | — |
| Configuration Interface | Serial (EPC8/EPC16) and JTAG (IEEE 1149.1) | — |
| RoHS Status | [DATA_NEEDED: RoHS status] | — |
| Series | — | FLEX 10KE |
| Logic Elements (LEs) | — | 1,728 |
| Embedded Array Blocks (EABs) | — | 6 |
| User I/Os | — | 246 |
| Logic Cells | — | 1728 |
| Propagation Delay | — | 0.6 ns (per digchip listing; internal frequency 80 MHz) |
| Number of Logic Elements | — | 24576 |
| Operating Temperature | — | 0 °C to +70 °C (Commercial) |
| Supply Voltage | — | [DATA_NEEDED: core and I/O rail voltages] |
| Configuration | — | Passive Serial / Active Serial / JTAG |
| Lead Free / RoHS | — | Non-RoHS (legacy, SnPb finish per FBGA-256 family) |