EPF10K30EFC256-3 vs EPF10K30EFC256-2N 比較
詳細並排比較 EPF10K30EFC256-3 由 Intel 與 EPF10K30EFC256-2N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
Intel
EPF10K30EFC256-2N - FLEX 10KE FPGA 30K Gates 256-BGA | Intel / Altera
EPF10K30EFC256-2N Obsolete規格比較
| 參數 | EPF10K30EFC256-3 | EPF10K30EFC256-2N |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | Obsolete | Obsolete |
| Family | FLEX 10KE | FLEX 10KE Embedded Programmable Logic Family |
| Typical Gates | 30,000 | 30,000 |
| Logic Elements / Cells | 1,728 | — |
| Logic Array Blocks (LABs) | 216 | — |
| Embedded RAM Bits | 24,576 | 24,576 |
| User I/O Pins | 176 | — |
| Maximum Operating Frequency | 200 MHz | — |
| Process Technology | 0.22 micrometer CMOS | 0.22 µm CMOS, SRAM-based |
| Core Supply Voltage (VCCINT) | 2.5 V | — |
| I/O Supply Voltage (VCCIO) | 3.3 V (multi-voltage I/O standard support) | — |
| 封裝 | 256-ball FineLine BGA | 256-ball FineLine BGA (PBGA256), 17 x 17 mm, 1.0 mm pitch |
| 安裝類型 | Surface Mount (BGA) | Surface Mount |
| Speed Grade | -3 (fastest) | -2N (mid-grade, 0.6 ns) |
| Temperature Grade | Commercial | — |
| Configuration Interface | Serial (EPC8/EPC16) and JTAG (IEEE 1149.1) | — |
| RoHS 狀態 | [DATA_NEEDED: RoHS status] | — |
| Series | — | FLEX 10KE |
| Logic Elements (LEs) | — | 1,728 |
| Embedded Array Blocks (EABs) | — | 6 |
| User I/Os | — | 246 |
| Logic Cells | — | 1728 |
| Propagation Delay | — | 0.6 ns (per digchip listing; internal frequency 80 MHz) |
| Number of Logic Elements | — | 24576 |
| 工作溫度 | — | 0 °C to +70 °C (Commercial) |
| 供應電壓 | — | [DATA_NEEDED: core and I/O rail voltages] |
| Configuration | — | Passive Serial / Active Serial / JTAG |
| Lead Free / RoHS | — | Non-RoHS (legacy, SnPb finish per FBGA-256 family) |