EPF10K30ETC144-3 vs EPF10K30ETI144-3 Comparison

Detailed side-by-side comparison of EPF10K30ETC144-3 by Altera and EPF10K30ETI144-3 by Altera. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K30ETC144-3 EPF10K30ETI144-3
Brand Altera Altera
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Obsolete
Manufacturer Altera (now Intel) —
Series FLEX 10KE FLEX-10KE
Family FLEX 10KE FLEX-10KE Embedded Programmable Logic Device
Logic Elements / Cells 1728 —
Typical Gates 30,000 —
Embedded Memory (bits) 24,576 —
Embedded Array Blocks (EABs) 13 6
Logic Array Blocks (LABs) 216 216
User I/O Count 102 —
Number of I/O Banks 8 —
Core Voltage 2.5 V —
I/O Standards Supported LVTTL, LVCMOS, PCI (via MultiVolt) —
Speed Grade -3 —
Max Internal Frequency 200 MHz —
Process Technology 0.22 µm CMOS SRAM —
Package 144-pin LQFP (TQFP) 144-LQFP (LFQFP)
Mounting Type Surface Mount Surface Mount (Gull Wing)
Operating Temperature (Commercial) 0 °C to +70 °C —
Configuration Mode Passive Serial / Active Serial / JTAG —
Configuration Voltage 5.0 V (EPC) / 2.5 V (core) —
RoHS Status [DATA_NEEDED: RoHS compliance status] Non-Compliant (Sn/Pb lead finish)
Lead-Free [DATA_NEEDED: lead-free reflow compatibility] —
Logic Elements — 1728
Embedded RAM — 24,576 bits
Maximum User I/O — 102
Maximum Equivalent Gates — 119,000
Pin-to-Pin Delay (Speed Grade) — 12.5 ns
Supply Voltage (Core) — 2.5 V / 3.3 V
I/O Voltage Tolerance — 5.0 V / 3.3 V / 2.5 V (multi-volt)
Operating Temperature — -40C to +85C (Industrial)
Package Height — 1.6 mm
Lead Finish — Tin/Lead (Sn/Pb)
Configuration Method — SRAM (volatile) + JTAG IEEE 1149.1

Datasheets & Resources

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