EPF10K30ETC144-3 vs EPF10K30ETI144-3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K30ETC144-3 sa pamamagitan ng Altera at EPF10K30ETI144-3 sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EPF10K30ETC144-3 | EPF10K30ETI144-3 |
|---|---|---|
| Brand | Altera | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Obsolete |
| Manufacturer | Altera (now Intel) | — |
| Series | FLEX 10KE | FLEX-10KE |
| Family | FLEX 10KE | FLEX-10KE Embedded Programmable Logic Device |
| Logic Elements / Cells | 1728 | — |
| Typical Gates | 30,000 | — |
| Embedded Memory (bits) | 24,576 | — |
| Embedded Array Blocks (EABs) | 13 | 6 |
| Logic Array Blocks (LABs) | 216 | 216 |
| User I/O Count | 102 | — |
| Number of I/O Banks | 8 | — |
| Core Voltage | 2.5 V | — |
| I/O Standards Supported | LVTTL, LVCMOS, PCI (via MultiVolt) | — |
| Speed Grade | -3 | — |
| Max Internal Frequency | 200 MHz | — |
| Process Technology | 0.22 µm CMOS SRAM | — |
| Packhaging | 144-pin LQFP (TQFP) | 144-LQFP (LFQFP) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (Gull Wing) |
| Operating Temperature (Commercial) | 0 °C to +70 °C | — |
| Configuration Mode | Passive Serial / Active Serial / JTAG | — |
| Configuration Voltage | 5.0 V (EPC) / 2.5 V (core) | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS compliance status] | Non-Compliant (Sn/Pb lead finish) |
| Lead-Free | [DATA_NEEDED: lead-free reflow compatibility] | — |
| Logic Elements | — | 1728 |
| Embedded RAM | — | 24,576 bits |
| Maximum User I/O | — | 102 |
| Maximum Equivalent Gates | — | 119,000 |
| Pin-to-Pin Delay (Speed Grade) | — | 12.5 ns |
| Supply Voltage (Core) | — | 2.5 V / 3.3 V |
| I/O Voltage Tolerance | — | 5.0 V / 3.3 V / 2.5 V (multi-volt) |
| Temperature na Operasyon | — | -40C to +85C (Industrial) |
| Package Height | — | 1.6 mm |
| Lead Finish | — | Tin/Lead (Sn/Pb) |
| Configuration Method | — | SRAM (volatile) + JTAG IEEE 1149.1 |