EPF10K30ETC144-3 vs EPF10K30ETI144-3 Comparación
Comparación detallada lado a lado de EPF10K30ETC144-3 por Altera y EPF10K30ETI144-3 por Altera. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EPF10K30ETC144-3 | EPF10K30ETI144-3 |
|---|---|---|
| Marca | Altera | Altera |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $35,20 | $29,80 |
| Manufacturer | Altera (now Intel) | — |
| Series | FLEX 10KE | FLEX-10KE |
| Family | FLEX 10KE | FLEX-10KE Embedded Programmable Logic Device |
| Logic Elements / Cells | 1728 | — |
| Typical Gates | 30,000 | — |
| Embedded Memory (bits) | 24,576 | — |
| Embedded Array Blocks (EABs) | 13 | 6 |
| Logic Array Blocks (LABs) | 216 | 216 |
| User I/O Count | 102 | — |
| Number of I/O Banks | 8 | — |
| Core Voltage | 2.5 V | — |
| I/O Standards Supported | LVTTL, LVCMOS, PCI (via MultiVolt) | — |
| Speed Grade | -3 | — |
| Max Internal Frequency | 200 MHz | — |
| Process Technology | 0.22 µm CMOS SRAM | — |
| Encapsulado | 144-pin LQFP (TQFP) | 144-LQFP (LFQFP) |
| Tipo de montaje | Surface Mount | Surface Mount (Gull Wing) |
| Operating Temperature (Commercial) | 0 °C to +70 °C | — |
| Configuration Mode | Passive Serial / Active Serial / JTAG | — |
| Configuration Voltage | 5.0 V (EPC) / 2.5 V (core) | — |
| Estado RoHS | [DATA_NEEDED: RoHS compliance status] | Non-Compliant (Sn/Pb lead finish) |
| Lead-Free | [DATA_NEEDED: lead-free reflow compatibility] | — |
| Logic Elements | — | 1728 |
| Embedded RAM | — | 24,576 bits |
| Maximum User I/O | — | 102 |
| Maximum Equivalent Gates | — | 119,000 |
| Pin-to-Pin Delay (Speed Grade) | — | 12.5 ns |
| Supply Voltage (Core) | — | 2.5 V / 3.3 V |
| I/O Voltage Tolerance | — | 5.0 V / 3.3 V / 2.5 V (multi-volt) |
| Temperatura de funcionamiento | — | -40C to +85C (Industrial) |
| Package Height | — | 1.6 mm |
| Lead Finish | — | Tin/Lead (Sn/Pb) |
| Configuration Method | — | SRAM (volatile) + JTAG IEEE 1149.1 |