EPF10K30ETC144-3 vs EPF10K30ETI144-3 Comparaison
Comparaison détaillée côte à côte de EPF10K30ETC144-3 par Altera et EPF10K30ETI144-3 par Altera. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EPF10K30ETC144-3 | EPF10K30ETI144-3 |
|---|---|---|
| Marque | Altera | Altera |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $35,20 | $29,80 |
| Manufacturer | Altera (now Intel) | — |
| Series | FLEX 10KE | FLEX-10KE |
| Family | FLEX 10KE | FLEX-10KE Embedded Programmable Logic Device |
| Logic Elements / Cells | 1728 | — |
| Typical Gates | 30,000 | — |
| Embedded Memory (bits) | 24,576 | — |
| Embedded Array Blocks (EABs) | 13 | 6 |
| Logic Array Blocks (LABs) | 216 | 216 |
| User I/O Count | 102 | — |
| Number of I/O Banks | 8 | — |
| Core Voltage | 2.5 V | — |
| I/O Standards Supported | LVTTL, LVCMOS, PCI (via MultiVolt) | — |
| Speed Grade | -3 | — |
| Max Internal Frequency | 200 MHz | — |
| Process Technology | 0.22 µm CMOS SRAM | — |
| Boîtier | 144-pin LQFP (TQFP) | 144-LQFP (LFQFP) |
| Type de montage | Surface Mount | Surface Mount (Gull Wing) |
| Operating Temperature (Commercial) | 0 °C to +70 °C | — |
| Configuration Mode | Passive Serial / Active Serial / JTAG | — |
| Configuration Voltage | 5.0 V (EPC) / 2.5 V (core) | — |
| Statut RoHS | [DATA_NEEDED: RoHS compliance status] | Non-Compliant (Sn/Pb lead finish) |
| Lead-Free | [DATA_NEEDED: lead-free reflow compatibility] | — |
| Logic Elements | — | 1728 |
| Embedded RAM | — | 24,576 bits |
| Maximum User I/O | — | 102 |
| Maximum Equivalent Gates | — | 119,000 |
| Pin-to-Pin Delay (Speed Grade) | — | 12.5 ns |
| Supply Voltage (Core) | — | 2.5 V / 3.3 V |
| I/O Voltage Tolerance | — | 5.0 V / 3.3 V / 2.5 V (multi-volt) |
| Température de fonctionnement | — | -40C to +85C (Industrial) |
| Package Height | — | 1.6 mm |
| Lead Finish | — | Tin/Lead (Sn/Pb) |
| Configuration Method | — | SRAM (volatile) + JTAG IEEE 1149.1 |