EPF6010ATC100-3N vs EPF6010ANTC100-3 Comparison
Detailed side-by-side comparison of EPF6010ATC100-3N by Intel and EPF6010ANTC100-3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EPF6010ATC100-3N - FLEX 6000 FPGA, 880 Cells, 100-TQFP | Intel
EPF6010ATC100-3N ⚠ Last Time BuyIntel
EPF6010ANTC100-3 - FLEX 6000 FPGA 880 LE 71 I/O 100-TQFP | Intel
EPF6010ANTC100-3 ⚠ Last Time BuySpecification Comparison
| Parameter | EPF6010ATC100-3N | EPF6010ANTC100-3 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Last Time Buy | Last Time Buy |
| Family | FLEX 6000 | FLEX 6000 |
| Logic Elements / Cells | 880 | — |
| Equivalent Gate Count | 10,000 gates | — |
| Logic Array Blocks (LABs) | 88 | — |
| User I/Os | 71 | — |
| Supply Voltage (Operating) | 3.0 V to 3.6 V | — |
| Maximum Internal Frequency | 142.86 MHz | — |
| Process Technology | 0.42 µm CMOS | 0.42 µm CMOS SRAM |
| Speed Grade | -3 | -3 |
| Package | 100-pin TQFP (14 x 14 x 1.4 mm) | 100-TQFP |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0 °C to +70 °C (commercial) | — |
| Programming Method | In-system SRAM via ByteBlaster/BitBlaster | — |
| MSL Level | 3 (168 hours) | — |
| RoHS Status | Compliant | [DATA_NEEDED: RoHS status] |
| Logic Elements | — | 880 LE |
| User I/O Count | — | 71 |
| Embedded Memory | — | 16000 bit |
| Number of Logic Array Blocks (LABs) | — | 8 |
| Core Voltage | — | 5 V |
| Configuration Interface | — | JTAG (IEEE 1149.1) / Serial / Parallel |
| Operating Temperature Range | — | [DATA_NEEDED: operating temperature range] |
| I/O Standards Supported | — | LVTTL, LVCMOS, PCI (MultiVolt I/O) |
| Programmable Interconnect | — | Continuous FastTrack |