EPF6010ATC144-3 vs EPF6016AFC256-3 Comparison
Detailed side-by-side comparison of EPF6010ATC144-3 by Intel and EPF6016AFC256-3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EPF6010ATC144-3 | EPF6016AFC256-3 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | NRND | Obsolete |
| Family | FLEX 6000 | FLEX 6000 |
| Device Type | FPGA (Field Programmable Gate Array) | FPGA (Field Programmable Gate Array) |
| System Gates | 10,000 | — |
| Logic Elements / Logic Cells | 880 | — |
| Maximum User I/O | 102 | — |
| Supply Voltage - Operating | 3.0 V to 3.6 V | — |
| Process Technology | 0.42 µm CMOS SRAM | 0.42 µm CMOS |
| Maximum Internal Frequency | 142.86 MHz | 142.86 MHz |
| Configuration Memory | SRAM (volatile, re-programmable) | — |
| Programming Interface | JTAG (IEEE Std 1149.1) / Serial | JTAG (IEEE 1149.1) |
| I/O Standards | LVTTL, LVCMOS, PCI compatible; multiVolt I/O | — |
| Package Type | 144-pin TQFP (Fine Line) | — |
| Pin Pitch | 0.5 mm | — |
| Operating Temperature Grade | Commercial / Industrial | — |
| Speed Grade | -3 | -3 |
| RoHS Status | [DATA_NEEDED: RoHS status] | — |
| Mounting Type | Surface Mount | Surface Mount (BGA) |
| Equivalent Gates | — | 16K |
| Logic Elements (LEs) | — | 1320 |
| Logic Array Blocks (LABs) | — | 132 |
| User I/Os | — | 171 |
| Edge Rate | — | 172 MHz |
| Core Supply Voltage | — | 3.3 V |
| Package | — | 256-ball FineLine BGA (FBGA) |
| Pin Count | — | 256 |
| Configuration Method | — | SRAM (volatile, requires external PROM) |
| Operating Temperature | — | 0 °C to +85 °C (commercial) |