EPF6010ATC144-3 vs EPF6016AFC256-3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF6010ATC144-3 sa pamamagitan ng Intel at EPF6016AFC256-3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EPF6010ATC144-3 | EPF6016AFC256-3 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Obsolete |
| Family | FLEX 6000 | FLEX 6000 |
| Device Type | FPGA (Field Programmable Gate Array) | FPGA (Field Programmable Gate Array) |
| System Gates | 10,000 | — |
| Logic Elements / Logic Cells | 880 | — |
| Maximum User I/O | 102 | — |
| Supply Voltage - Operating | 3.0 V to 3.6 V | — |
| Process Technology | 0.42 µm CMOS SRAM | 0.42 µm CMOS |
| Maximum Internal Frequency | 142.86 MHz | 142.86 MHz |
| Configuration Memory | SRAM (volatile, re-programmable) | — |
| Programming Interface | JTAG (IEEE Std 1149.1) / Serial | JTAG (IEEE 1149.1) |
| I/O Standards | LVTTL, LVCMOS, PCI compatible; multiVolt I/O | — |
| Package Type | 144-pin TQFP (Fine Line) | — |
| Pin Pitch | 0.5 mm | — |
| Operating Temperature Grade | Commercial / Industrial | — |
| Speed Grade | -3 | -3 |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Equivalent Gates | — | 16K |
| Logic Elements (LEs) | — | 1320 |
| Logic Array Blocks (LABs) | — | 132 |
| User I/Os | — | 171 |
| Edge Rate | — | 172 MHz |
| Core Supply Voltage | — | 3.3 V |
| Packhaging | — | 256-ball FineLine BGA (FBGA) |
| Bilang ng Pin | — | 256 |
| Configuration Method | — | SRAM (volatile, requires external PROM) |
| Temperature na Operasyon | — | 0 °C to +85 °C (commercial) |