EPF6024AFC256-1 vs EPF6024AFI256-2 Comparison

Detailed side-by-side comparison of EPF6024AFC256-1 by Intel and EPF6024AFI256-2 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF6024AFC256-1 EPF6024AFI256-2
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete NRND
Family FLEX 6000 FLEX 6000
Device Logic Elements / Cells 1960 —
Equivalent Gate Count 24,000 gates —
Logic Array Blocks (LABs) 196 —
Number of I/O 219 (218 user I/O pins) —
Maximum Internal Frequency 200 MHz —
Internal Frequency 172 MHz —
Process Technology 0.42 µm CMOS, SRAM-based 0.42 µm CMOS
Supply Voltage (Core) 3.3 V —
Package Type 256-pin FBGA (FineLine BGA) —
Mounting Type Surface Mount Surface Mount
Operating Temperature 0°C to +85°C (commercial) -40 °C to +85 °C (Industrial)
Configuration Method SRAM, serial configuration device required —
RoHS Status [DATA_NEEDED: rohs status] Not RoHS compliant (SnPb)
Lead-Free [DATA_NEEDED: lead-free status] —
Series — FLEX 6000
Typical Gates — 24,000
Logic Elements (LEs) — 1,960
User I/Os — 196
Core Voltage — 5.0 V
Maximum Frequency — 166.67 MHz
Package — 256-FBGA
Architecture — OptiFLEX (LUT-based)
Configuration — SRAM (volatile, requires config device)
I/O Compatibility — MultiVolt (3.3V / 5.0V)

Datasheets & Resources

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