EPF6024AFC256-1 vs EPF6024AFI256-2 Vergleich
Detaillierter Direktvergleich von EPF6024AFC256-1 von Intel und EPF6024AFI256-2 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EPF6024AFC256-1 | EPF6024AFI256-2 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $24,95 | $18,20 |
| Family | FLEX 6000 | FLEX 6000 |
| Device Logic Elements / Cells | 1960 | — |
| Equivalent Gate Count | 24,000 gates | — |
| Logic Array Blocks (LABs) | 196 | — |
| Number of I/O | 219 (218 user I/O pins) | — |
| Maximum Internal Frequency | 200 MHz | — |
| Internal Frequency | 172 MHz | — |
| Process Technology | 0.42 µm CMOS, SRAM-based | 0.42 µm CMOS |
| Supply Voltage (Core) | 3.3 V | — |
| Package Type | 256-pin FBGA (FineLine BGA) | — |
| Montageart | Surface Mount | Surface Mount |
| Betriebstemperatur | 0°C to +85°C (commercial) | -40 °C to +85 °C (Industrial) |
| Configuration Method | SRAM, serial configuration device required | — |
| RoHS-Status | [DATA_NEEDED: rohs status] | Not RoHS compliant (SnPb) |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Series | — | FLEX 6000 |
| Typical Gates | — | 24,000 |
| Logic Elements (LEs) | — | 1,960 |
| User I/Os | — | 196 |
| Core Voltage | — | 5.0 V |
| Maximum Frequency | — | 166.67 MHz |
| Gehäuse | — | 256-FBGA |
| Architecture | — | OptiFLEX (LUT-based) |
| Configuration | — | SRAM (volatile, requires config device) |
| I/O Compatibility | — | MultiVolt (3.3V / 5.0V) |