EPF6024AFI256-2 vs EPF6024AFC256-1 Comparison

Detailed side-by-side comparison of EPF6024AFI256-2 by Intel and EPF6024AFC256-1 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF6024AFI256-2 EPF6024AFC256-1
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status NRND Obsolete
Family FLEX 6000 FLEX 6000
Series FLEX 6000 —
Typical Gates 24,000 —
Logic Elements (LEs) 1,960 —
User I/Os 196 —
Core Voltage 5.0 V —
Process Technology 0.42 µm CMOS 0.42 µm CMOS, SRAM-based
Maximum Frequency 166.67 MHz —
Package 256-FBGA —
Mounting Type Surface Mount Surface Mount
Operating Temperature -40 °C to +85 °C (Industrial) 0°C to +85°C (commercial)
Architecture OptiFLEX (LUT-based) —
Configuration SRAM (volatile, requires config device) —
I/O Compatibility MultiVolt (3.3V / 5.0V) —
RoHS Status Not RoHS compliant (SnPb) [DATA_NEEDED: rohs status]
Device Logic Elements / Cells — 1960
Equivalent Gate Count — 24,000 gates
Logic Array Blocks (LABs) — 196
Number of I/O — 219 (218 user I/O pins)
Maximum Internal Frequency — 200 MHz
Internal Frequency — 172 MHz
Supply Voltage (Core) — 3.3 V
Package Type — 256-pin FBGA (FineLine BGA)
Configuration Method — SRAM, serial configuration device required
Lead-Free — [DATA_NEEDED: lead-free status]

Datasheets & Resources

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