EPF8282ALC84-2 vs EPF8282ATC100-3 Comparison
Detailed side-by-side comparison of EPF8282ALC84-2 by Intel and EPF8282ATC100-3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EPF8282ALC84-2 | EPF8282ATC100-3 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Obsolete |
| Family | FLEX 8000 | FLEX 8000 |
| Device Logic Elements / FFs | 208 | — |
| Usable Gates | 2,500 | 2,500 |
| Logic Array Blocks (LABs) | 26 | — |
| Maximum User I/Os | 68 | — |
| Process Technology | 0.42 micrometer CMOS, SRAM-based | 0.42 micron CMOS SRAM |
| Package | 84-pin LCC (J-Lead), PLCC-84 | 100-pin TQFP (100-TQFP) |
| Core Supply Voltage | 5.0 V | — |
| Configuration Method | External configuration device (EPC1/EPC1441) or JTAG | SRAM, EPC1/EPC1064/EPC1213/EPC1441, microprocessor |
| In-Circuit Reconfigurability | Yes (ICR) | — |
| JTAG Support | IEEE 1149.1 boundary-scan | — |
| Temperature Grade (this part) | Commercial (suffix 'C' in package code) | — |
| Speed Grade | -2 | -3 |
| RoHS Status | Unknown (legacy Altera part, pre-RoHS transition) | — |
| Lead-Free | Unknown | — |
| Mounting Type | Surface Mount (J-Lead) | — |
| Logic Cells (LEs) | — | 208 |
| Typical Gates Equivalent | — | 12,000 |
| Maximum User I/O | — | 78 |
| Number of Logic Array Blocks (LABs) | — | 26 |
| Embedded Array Blocks (EABs) | — | 6 |
| Total RAM Bits | — | 12 Kbits |
| Supply Voltage (Core) | — | 5 V |
| MultiVolt I/O Support | — | 3.3 V / 5 V |
| Maximum Frequency | — | 125 MHz |
| Operating Temperature (Commercial) | — | 0 C to +70 C |
| In-Circuit Reconfigurable | — | Yes (ICR) |
| Boundary Scan | — | JTAG IEEE 1149.1 |