EPF8282ATC100-2 vs EPF8282ATI100-3S Comparison

Detailed side-by-side comparison of EPF8282ATC100-2 by Intel and EPF8282ATI100-3S by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF8282ATC100-2 EPF8282ATI100-3S
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active NRND
Family FLEX 8000 FLEX 8000
Usable Gates 2,500 —
Logic Cells 208 —
Logic Array Blocks (LABs) 26 —
User I/Os 78 —
Flip-Flops 282 —
Supply Voltage 5 V —
Process Technology 0.42 µm CMOS CMOS
Package 100-pin TQFP —
Operating Temperature 0 °C to 70 °C (Commercial) -40C to +85C (industrial, I grade)
Speed Grade -2 -3
Mounting Type Surface Mount Surface Mount
Configuration Memory SRAM (volatile, requires external boot) —
Development Tool Altera MAX+PLUS II —
RoHS Status [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS compliance status]
Device Logic Elements / Cells — 208
Number of LABs/CLBs — 26
Number of Logic Elements / Cells — 208
Total RAM Bits — [DATA_NEEDED: embedded RAM bits]
Number of I/O — 78
Number of Gates — 2500
Voltage - Supply — 5 V
Package / Case — 100-TQFP
Supplier Device Package — 100-TQFP
Maximum Toggle Frequency — 125 MHz
Architecture — SRAM-based, in-circuit reconfigurable (ICR)
Boundary Scan — IEEE 1149.1 (JTAG)

Datasheets & Resources

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