EPF8282ATC100-2 vs EPF8282ATI100-3S Vergleich
Detaillierter Direktvergleich von EPF8282ATC100-2 von Intel und EPF8282ATI100-3S von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EPF8282ATI100-3S - FLEX 8000 FPGA, 2.5K Gates, 100-TQFP | Intel / Altera
EPF8282ATI100-3S NrndSpezifikationsvergleich
| Parameter | EPF8282ATC100-2 | EPF8282ATI100-3S |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $9,75 | $14,50 |
| Family | FLEX 8000 | FLEX 8000 |
| Usable Gates | 2,500 | — |
| Logic Cells | 208 | — |
| Logic Array Blocks (LABs) | 26 | — |
| User I/Os | 78 | — |
| Flip-Flops | 282 | — |
| Versorgungsspannung | 5 V | — |
| Process Technology | 0.42 µm CMOS | CMOS |
| Gehäuse | 100-pin TQFP | — |
| Betriebstemperatur | 0 °C to 70 °C (Commercial) | -40C to +85C (industrial, I grade) |
| Speed Grade | -2 | -3 |
| Montageart | Surface Mount | Surface Mount |
| Configuration Memory | SRAM (volatile, requires external boot) | — |
| Development Tool | Altera MAX+PLUS II | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance status] |
| Device Logic Elements / Cells | — | 208 |
| Number of LABs/CLBs | — | 26 |
| Number of Logic Elements / Cells | — | 208 |
| Total RAM Bits | — | [DATA_NEEDED: embedded RAM bits] |
| Number of I/O | — | 78 |
| Number of Gates | — | 2500 |
| Voltage - Supply | — | 5 V |
| Gehäuse / Bauform | — | 100-TQFP |
| Supplier Device Package | — | 100-TQFP |
| Maximum Toggle Frequency | — | 125 MHz |
| Architecture | — | SRAM-based, in-circuit reconfigurable (ICR) |
| Boundary Scan | — | IEEE 1149.1 (JTAG) |