EPM2210F256C4N vs EPM1270F256I5N Comparison

Detailed side-by-side comparison of EPM2210F256C4N by Intel and EPM1270F256I5N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPM2210F256C4N EPM1270F256I5N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Family MAX II MAX II (EPM1270)
Device Type CPLD CPLD - Complex Programmable Logic Device
Logic Elements (LE) 2210 —
Macro Cells 1700 980
User Flash Memory 204 Kbit 8 Kbits
Maximum Internal Frequency 247.5 MHz —
Pin-to-Pin Propagation Delay (tPD) 7.0 ns —
Maximum User I/O Pins 212 (varies with package) —
Global Clock Networks 4 —
Process Technology 0.18 µm 0.18-micron Flash-based CMOS
Core Supply Voltage 3.0 V to 3.6 V (3.3 V typical) —
MultiVolt I/O Standards 1.5 V / 1.8 V / 2.5 V / 3.3 V LVTTL/LVCMOS, PCI 66 MHz —
Operating Temperature Range 0 °C to +85 °C (Commercial) —
Package 256-ball FineLine BGA (FBGA) 256-ball FBGA (FineLine BGA), 17 x 17 mm
Programming Interface JTAG IEEE Std. 1149.1 + ISP JTAG IEEE 1149.1 (boundary-scan + ISP)
Mounting Type Surface Mount (BGA) Surface Mount (SMT, BGA)
RoHS Status Compliant Compliant
Lead-Free Yes —
Series — MAX II
Logic Elements — 1270
User I/O Pins — 212
Maximum Operating Frequency — 201.1 MHz
Pin-to-Pin Logic Delay — 6.2 ns (I5 speed grade)
External Supply Voltage — 2.5 V / 3.3 V
Internal Core Voltage — 1.8 V (on-chip regulator)
I/O Bank Support — 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) + 3.3 V PCI-compliant bank
Configuration Memory — Non-volatile Flash (instant-on)
Operating Temperature — -40C to +100C (TJ), industrial
Speed Grade — I5 (industrial, 6.2 ns tPD)
Halogen Free — Compliant (per GlobalSpec)
Country of Origin — Malaysia / Republic of Korea

Datasheets & Resources

Browse All Products Create BOM Request Quote