EPM2210F256C4N vs EPM1270F256I5N 对比
详细并排对比 EPM2210F256C4N 出自 Intel 和 EPM1270F256I5N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EPM2210F256C4N | EPM1270F256I5N |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $39.85 | $14.85 |
| Family | MAX II | MAX II (EPM1270) |
| Device Type | CPLD | CPLD - Complex Programmable Logic Device |
| Logic Elements (LE) | 2210 | — |
| Macro Cells | 1700 | 980 |
| User Flash Memory | 204 Kbit | 8 Kbits |
| Maximum Internal Frequency | 247.5 MHz | — |
| Pin-to-Pin Propagation Delay (tPD) | 7.0 ns | — |
| Maximum User I/O Pins | 212 (varies with package) | — |
| Global Clock Networks | 4 | — |
| Process Technology | 0.18 µm | 0.18-micron Flash-based CMOS |
| Core Supply Voltage | 3.0 V to 3.6 V (3.3 V typical) | — |
| MultiVolt I/O Standards | 1.5 V / 1.8 V / 2.5 V / 3.3 V LVTTL/LVCMOS, PCI 66 MHz | — |
| 工作温度范围 | 0 °C to +85 °C (Commercial) | — |
| 封装 | 256-ball FineLine BGA (FBGA) | 256-ball FBGA (FineLine BGA), 17 x 17 mm |
| Programming Interface | JTAG IEEE Std. 1149.1 + ISP | JTAG IEEE 1149.1 (boundary-scan + ISP) |
| 安装类型 | Surface Mount (BGA) | Surface Mount (SMT, BGA) |
| RoHS 状态 | Compliant | Compliant |
| Lead-Free | Yes | — |
| Series | — | MAX II |
| Logic Elements | — | 1270 |
| User I/O Pins | — | 212 |
| Maximum Operating Frequency | — | 201.1 MHz |
| Pin-to-Pin Logic Delay | — | 6.2 ns (I5 speed grade) |
| External Supply Voltage | — | 2.5 V / 3.3 V |
| Internal Core Voltage | — | 1.8 V (on-chip regulator) |
| I/O Bank Support | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) + 3.3 V PCI-compliant bank |
| Configuration Memory | — | Non-volatile Flash (instant-on) |
| 工作温度 | — | -40C to +100C (TJ), industrial |
| Speed Grade | — | I5 (industrial, 6.2 ns tPD) |
| 无卤 | — | Compliant (per GlobalSpec) |
| Country of Origin | — | Malaysia / Republic of Korea |