EPM1270F256I5N - 980-Macrocell MAX II CPLD, 256-FBGA | Intel / Altera
MPN: EPM1270F256I5N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $20.75 | $20.75 |
| 10 | $18.5 | $185.00 |
| 100 | $16.2 | $1,620.00 |
| 500 | $14.1 | $7,050.00 |
| 1,000 | $12.4 | $12,400.00 |
Drop-in alternatives for EPM1270F256I5N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPM1270F256I5
✅ Drop-In✓ In Stock
$16.9 / Unit
View Datasheet →EPM1270F256I5RR
✅ Drop-In📋 Reference alternative (not in catalog)
EPM1270F256I5ES
✅ Drop-In📋 Reference alternative (not in catalog)
EPM1270F256C5N
✅ Drop-In✓ In Stock
$16.2 / Unit
View Datasheet →EPM1270F256C5
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$25.4 / Unit
View Datasheet →EPM1270F256
✅ Drop-In✓ In Stock
$10.85 / Unit
View Datasheet →EPM1270GF256C3N
✅ Drop-In📋 Reference alternative (not in catalog)
EPM1270F256I5N Maximum Ratings & Electrical Characteristics
| Family | MAX II |
| Device Type | CPLD - Complex Programmable Logic Device |
| Macro Cells | 980 |
| Logic Elements | 1270 |
| User I/O Pins (max) | 212 |
| User Flash Memory | 8 Kbits |
| Package / Case | 256-FBGA (FineLine BGA, 17x17 mm) |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +100C (TJ) |
| Speed Grade | I5 |
| Pin-to-Pin Logic Delay (tPD) | 6.2 ns |
| Maximum Operating Frequency (fMAX) | 201.1 MHz |
| Supply Voltage - Core | 1.8 V (internal, regulated) |
| Supply Voltage - I/O | 2.5 V / 3.3 V (MultiVolt: 1.5 V / 1.8 V / 2.5 V / 3.3 V) |
| Programming Interface | JTAG (IEEE 1149.1) - in-system programmable |
| Process Technology | 0.18 um Flash-based CMOS |
| RoHS Status | Compliant |
| Halogen Free | Compliant |
| Country of Origin | Malaysia / Republic of Korea |
EPM1270F256I5N Pin Configuration
| Pin A1 | I/O — User I/O bank |
| Pin A2 | I/O — User I/O bank |
| Pin A3 | I/O — User I/O bank |
| Pin A4 | I/O — User I/O bank |
| Pin A5 | I/O — User I/O bank |
| Pin A6 | I/O — User I/O bank |
| Pin A7 | I/O — User I/O bank |
| Pin A8 | I/O — User I/O bank |
| Pin A9 | I/O — User I/O bank |
| Pin A10 | I/O — User I/O bank |
| Pin A11 | I/O — User I/O bank |
| Pin A12 | I/O — User I/O bank |
| Pin A13 | I/O — User I/O bank |
| Pin A14 | I/O — User I/O bank |
| Pin A15 | I/O — User I/O bank |
| Pin A16 | I/O — User I/O bank |
| Pin B1 | I/O — User I/O bank |
| Pin B16 | I/O — User I/O bank |
| Pin TDO | TDO — JTAG Test Data Out (dedicated) |
| Pin TMS | TMS — JTAG Test Mode Select (dedicated) |
| Pin TCK | TCK — JTAG Test Clock (dedicated) |
| Pin TDI | TDI — JTAG Test Data In (dedicated) |
| Pin nCE | nCE — Chip Enable (dedicated, optional) |
| Pin nCONFIG | nCONFIG — Configuration / Reset (dedicated) |
| Pin VCCINT | VCCINT — Internal core 1.8 V supply (regulated internally from VCCIO) |
| Pin VCCIO[1..4] | VCCIO1..4 — I/O bank supplies 1.5/1.8/2.5/3.3 V (MultiVolt) |
| Pin GND | GND — Common ground - multiple balls |
| Pin NC | NC — Not connected / depopulated corner balls |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM1270F256I5N is suitable for 7 applications: Bus Interface Bridging (PCI / ISA / Legacy MCU), I/O Expansion and Voltage-Level Translation, Power-Up Sequencing and Reset Distribution, Glue-Logic Consolidation Replacing Discrete PAL/GAL, Industrial Control and Factory Automation, Telecom Line Cards and Baseband Boards, Automotive Infotainment Subsystems.
Bus Interface Bridging (PCI / ISA / Legacy MCU)
The EPM1270F256I5N is widely used as a bus-bridge glue-logic device between legacy 5 V / 3.3 V MCUs and 3.3 V PCI peripherals. With 212 user I/O, MultiVolt I/O banks supporting 1.5/1.8/2.5/3.3 V signaling, and 6.2 ns pin-to-pin delay, it can implement 32-bit address/data steering, wait-state insertion, and chip-select decoding in a single chip. The 980 macrocells comfortably absorb typical bus-multiplexer state machines, while the instant-on Flash architecture eliminates the boot-PROM cost required by SRAM FPGAs. Industrial temperature range ensures reliable operation in factory-floor controllers where PCI cards must hot-swap cleanly.
Recommended
I/O Expansion and Voltage-Level Translation
Designers deploy EPM1270F256I5N to add 200+ GPIOs to SoCs that have insufficient native I/O for parallel buses, RGB LCDs, or sensor arrays. The four MultiVolt I/O banks allow direct level-shifting between 1.5 V, 1.8 V, 2.5 V, and 3.3 V domains without external translators, eliminating dozens of discrete level-shifters on dense boards. With 201.1 MHz fMAX and 6.2 ns tPD, the CPLD can debounce, synchronize, and serialize asynchronous signals into SPI or I2C streams at tens of MHz - critical for industrial touch panels and motor-control front ends where real-time response matters.
Recommended
Power-Up Sequencing and Reset Distribution
Industrial and telecom power trees require deterministic, glitch-free sequencing of 1.0 V, 1.8 V, 2.5 V, and 3.3 V rails to protect downstream ASICs. The EPM1270F256I5N with its instant-on Flash configuration is ideal here: it begins executing user logic within microseconds of VCCIO reaching 2.5 V, generating precise PG (power-good) and EN signals with nanosecond accuracy. The 980 macrocells can host multiple independent sequencer state machines for 6-12 rails, while JTAG-based in-system programmability lets designers update sequencing firmware without replacing the chip. Industrial -40C to +100C operation handles outdoor telecom enclosures.
Recommended
Glue-Logic Consolidation Replacing Discrete PAL/GAL
The EPM1270F256I5N is a direct consolidation target for designs that previously stacked 3-6 discrete PAL/GAL devices for chip-select, address-latch, and interrupt-priority logic. With 980 macrocells it absorbs the entire discrete-logic BOM into one FBGA-256 chip, freeing PCB area for additional features. Compared to a 5-gate GAL design, the CPLD cuts board area by 60-80%, simplifies test (full JTAG boundary-scan), and adds in-system reprogrammability - allowing last-minute board-revision fixes without respinning the PCB.
Recommended
Industrial Control and Factory Automation
Factory PLCs, motor drives, and process-control front-ends use EPM1270F256I5N as a deterministic, low-latency supervisor that runs alongside a microcontroller. The 6.2 ns tPD enables sub-microsecond response to over-current or encoder-fault events - faster than any MCU interrupt cycle - while 212 user I/O support direct parallel interfaces to 24 V opto-isolated field wiring via MultiVolt banks. Industrial -40C to +100C operation handles unconditioned cabinet environments, and the 8 Kbit user Flash stores calibration tables and firmware-revision IDs across the product lifecycle.
Recommended
Telecom Line Cards and Baseband Boards
Telecom line cards leverage EPM1270F256I5N for TDM bus grooming, framer configuration, and clock-distribution glue. The part's 201.1 MHz fMAX comfortably clocks 8/16-bit TDM streams, while 212 I/O are sufficient to fan out multiple E1/T1 framers. Industrial temperature, halogen-free RoHS compliance, and the 17x17 mm FBGA-256 footprint enable dense, reflow-compatible designs on multilayer backplanes. The instant-on Flash configuration is critical: line cards must come up in deterministic state after a brownout, with no external boot-PROM dependency.
Recommended
Automotive Infotainment Subsystems
Although EPM1270F256I5N itself is industrial-temperature (not AEC-Q100), the MAX II family is used in non-safety automotive infotainment boards for LVDS display bridging, CAN bus message-routing glue, and backlight PWM control. Designers choose this part because the FBGA-256 footprint, instant-on Flash, and MultiVolt I/O allow direct connection to 1.8 V application processors and 3.3 V display drivers without external level shifters. Verify with the customer that industrial-grade parts satisfy their reliability requirements, since automotive qualification would require a different MAX II variant.
Recommended
Recommended Products Summary
Engineering reference data for EPM1270F256I5N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM1270F256I5 | EPM1270F256I5RR | EPM1270F256I5ES | EPM1270F256C5N | EPM1270F256C5 | EPM1270F256 | EPM1270GF256C3N |
|---|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 256-FBGA | 256-FBGA | 256-FBGA | 256-FBGA | 256-FBGA | 256-FBGA | 256-FBGA | 256-FBGA |
| Macro Cells | 980 | 980 | 980 | 980 | 980 | 980 | 980 | 980 |
| Speed Grade / tPD | I5 / 6.2 ns | I5 / 6.2 ns | I5 / 6.2 ns | I5 / 6.2 ns | C5 / ~7.0 ns | C5 / ~7.0 ns | [DATA_NEEDED] | C3 / ~7.0 ns (MAX II G) |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | [DATA_NEEDED] | 0C to +85C (Commercial) |
| Family | MAX II | MAX II | MAX II | MAX II | MAX II | MAX II | MAX II | MAX II G |
| Halogen Free | Yes | No | [DATA_NEEDED] | [DATA_NEEDED] | Yes | No | [DATA_NEEDED] | Yes |
| Programming | JTAG ISP | JTAG ISP | JTAG ISP | JTAG ISP | JTAG ISP | JTAG ISP | JTAG ISP | JTAG ISP |
| Approx Unit Price (qty 1) | $20.75 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Instant-on Flash configuration - no boot PROM required (vs SRAM-based FPGAs (Cyclone, etc.))
- 980 macrocells with 212 user I/O and MultiVolt banks (vs Smaller MAX II devices (EPM240, EPM570))
- Industrial temperature with halogen-free RoHS (vs EPM1270F256C5N (commercial, 0C-85C))
Design Notes
The 256-FBGA package requires a minimum 4-layer PCB with continuous ground and power planes directly under the BGA field. Use 0.5 mm pitch ball-to-trace micro-via-in-pad or dog-bone fan-out - 0.4 mm trace/space is recommended. The 17x17 mm body and 1.0 mm ball pitch (typical for FBGA) demand laser-drilled vias; standard 0.3 mm mechanical drills will not fit between balls. Place decoupling capacitors on the back side directly beneath the VCCIO/VCCINT ball groups using 0.1 uF X7R ceramics plus one 10 uF bulk per rail.
MAX II CPLDs generate the internal 1.8 V VCCINT from VCCIO via an on-chip regulator - never connect an external 1.8 V supply to VCCINT pins or you will damage the internal LDO. MultiVolt I/O banks must each have their VCCIO pin connected, even if a bank is unused, or floating banks can draw leakage and fail JTAG programming. Per the Altera handbook, JTAG TCK should be pulled low through 10 kohm when not driven, and unused nCE/nCONFIG must be tied to VCCIO via 10 kohm pull-ups.
For MultiVolt I/O banks driving 3.3 V PCI peripherals, place the bank VCCIO at 3.3 V and reserve the entire bank for PCI signals only - mixing PCI with non-PCI I/O violates the PCI electrical specification. Keep JTAG TCK trace length under 100 mm and route it on the inner layer with ground stitching vias every 30 mm to minimize ringing. USB-Blaster or ByteBlaster programming cables can drive TCK at 10 MHz but marginal signal integrity will cause programming failures - verify with the Quartus Programmer tool before committing to production boards.
MAX II CPLDs are low-power but the FBGA-256 package still requires thermal relief for industrial-temperature designs. With all 980 macrocells switching at 100 MHz and 3.3 V VCCIO, estimated: typical Icco = 50-80 mA worst case, leading to ~250 mW dissipation. The 17x17 mm FBGA with 4-layer PCB has theta_JA approximately 25-30 C/W (estimated based on JEDEC EIA/JESD51 test conditions), giving a 6-8 C junction rise above ambient - well within the -40C to +100C rating. For enclosed industrial cabinets, derate ambient by 10-15 C.
Compliance Information
RoHS and halogen-free compliant per GlobalSpec datasheet record. Industrial temperature grade - not AEC-Q100 qualified for automotive safety applications.
