H5AN4G8NBJR-RDC vs MT40A512M8RH-083E Comparison

Detailed side-by-side comparison of H5AN4G8NBJR-RDC by SK hynix and MT40A512M8RH-083E by Micron Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Micron Technology
MT40A512M8RH-083E MT40A512M8RH-083E - 4Gb DDR4 512Mx8 2400MHz | Micron

MT40A512M8RH-083E - 4Gb DDR4 512Mx8 2400MHz | Micron

MT40A512M8RH-083E ✓ Active

Specification Comparison

Parameter H5AN4G8NBJR-RDC MT40A512M8RH-083E
Brand SK hynix Micron Technology
Category Memory ICs Memory ICs
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $2.95 $3.30
Memory Type DDR4 SDRAM DDR4 SDRAM
Density 4 Gbit 4 Gbit
Organization 512M x 8 512M x 8
Interface DDR4 (Double Data Rate IV) —
Package 78-ball FBGA 78-ball FBGA (9 x 10.5 mm)
Mounting Type Surface Mount —
Supply Voltage [DATA_NEEDED: VDD supply voltage] —
Data Rate [DATA_NEEDED: speed grade Mbps] —
Bank Architecture 8 banks with 4 bank groups (x8) —
Refresh Auto-refresh and self-refresh 64 ms, 8192-cycle refresh (to 95C)
Temperature Grade [DATA_NEEDED: operating temperature range] —
Termination On-Die Termination (ODT) —
RoHS Status Lead-Free & Halogen-Free (RoHS Compliant) Compliant
Process Technology CMOS —
Manufacturer SK hynix —
Family Series H5AN4G4/8/6NBJR —
Industry Speed Grade — DDR4-2400
Clock Rate — 1.2 GHz
Internal Banks — 8 banks (2 groups of 4)
Prefetch — 8n-bit
VDD / VDDQ — 1.2 V +/-60 mV
VPP — 2.5 V, -125 mV/+250 mV
I/O Structure — 1.2 V pseudo open-drain
VREFDQ — On-die internal, adjustable generation
Operating Temperature — 0C to +95C
FBGA Code — D9TGG
Marking Code — D9TGG
Data Strobe Preamble — Programmable
CAS Latency — [DATA_NEEDED: CAS latency per speed bin table]

Datasheets & Resources

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