H5AN8G4NAFR-VKC vs H5AN8G8NAFR-VKC Comparison
Detailed side-by-side comparison of H5AN8G4NAFR-VKC by SK hynix and H5AN8G8NAFR-VKC by SK hynix. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | H5AN8G4NAFR-VKC | H5AN8G8NAFR-VKC |
|---|---|---|
| Brand | SK hynix | SK hynix |
| Category | Memory ICs | Memory ICs |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $2.98 | $4.15 |
| Memory Type | DDR4 SDRAM | DDR4 SDRAM |
| Density | 8 Gb | 8 Gb |
| Organization | 2G x 4 | 1G x 8 |
| Data Rate | 2666 Mbps per pin (DDR4-2666) | — |
| CAS Latency (CL) | 19 (CL19, speed bin VK) | — |
| Supply Voltage (VDD) | 1.2 V | 1.2 V |
| I/O Voltage (VDDQ) | 1.2 V | — |
| Package | 78-ball FBGA (PBGA78) | 78-ball FBGA |
| Mounting Type | Surface Mount | Surface Mount |
| Technology | CMOS | — |
| RoHS Status | Compliant (Lead-Free & Halogen-Free) | Compliant (Lead-Free & Halogen-Free) |
| Family | H5AN8G4NAFR-xxC / H5AN8G8NAFR-xxC / H5AN8G6NAFR-xxC | — |
| Application | Main memory requiring large density and high bandwidth | — |
| Datasheet Revision | Rev. 1.2 (Jul. 2017) | — |
| Operating Temperature | [DATA_NEEDED: Operating Temperature] | [DATA_NEEDED: operating temperature range] |
| Refresh | [DATA_NEEDED: Refresh specification] | — |
| Speed Grade | — | DDR4-2666 (VKC bin) |
| Interface | — | SSTL12 |
| Burst Length | — | 8 (BL8) |
| Bank Group Architecture | — | Supported (per DDR4 JEDEC architecture) |
| On-Die Termination (ODT) | — | Yes |
| DLL | — | Yes (DLL for output skew control) |
| Process Technology | — | CMOS |
| Recommended Application | — | Main memory requiring large density and high bandwidth |