H5AN8G6NDJR-XNC vs MT40A512M16JY-075E Comparison

Detailed side-by-side comparison of H5AN8G6NDJR-XNC by SK hynix and MT40A512M16JY-075E by Micron Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

SK hynix
H5AN8G6NDJR-XNC H5AN8G6NDJR-XNC - 8Gb DDR4-3200 x16 DRAM | SK Hynix

H5AN8G6NDJR-XNC - 8Gb DDR4-3200 x16 DRAM | SK Hynix

H5AN8G6NDJR-XNC ✓ Active
Micron Technology
MT40A512M16JY-075E MT40A512M16JY-075E - 8Gb DDR4 SDRAM 512Mx16 | Micron

MT40A512M16JY-075E - 8Gb DDR4 SDRAM 512Mx16 | Micron

MT40A512M16JY-075E ✓ Active

Specification Comparison

Parameter H5AN8G6NDJR-XNC MT40A512M16JY-075E
Brand SK hynix Micron Technology
Category Memory ICs Memory ICs
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $55.68 $30.50
Memory Type DDR4 SDRAM DDR4 SDRAM
Memory Size 8 Gb 8 Gbit
Memory Organization 512M x16 —
Data Rate 3200 Mbps 2666 MT/s
Supply Voltage (VDD) 1.2 V (max 1.26 V) —
Package FBGA-96 (13x7.5 mm) 96-FBGA (8x14)
Number of Terminals 96 —
Maximum Operating Temperature 85 °C —
Input/Output Type COMMON —
RoHS Compliant —
Lead-Free Yes —
Halogen Free Yes —
Auto Self-Refresh Yes —
Auto Precharge Yes —
Data Mask Yes —
Dynamic On-Chip Termination Yes —
ZQ Calibration Yes —
CRC Function Yes —
Write Leveling Yes —
Asynchronous Reset Yes —
Organization — 512M x 16
Clock Frequency — 1.33 GHz
Supply Voltage (VDD/VDDQ) — 1.14V to 1.26V
VPP Voltage — 2.5V (-125mV, +250mV)
Interface — Parallel
Mounting Type — Surface Mount
Operating Temperature Range — 0°C to +95°C (TC)
Refresh Time — 8192 cycles; 64ms at -40°C to 85°C, 32ms at >85°C to 95°C, 16ms at >95°C
RoHS Status — Compliant
Features — Auto precharge, data mask, dynamic on-chip termination, write leveling, auto self-refresh, CRC
I/O Type — 1.2V pseudo open-drain

Datasheets & Resources

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