H5ANAG6NAMR-UHC vs H5ANAG6NBJR-UHC Comparison

Detailed side-by-side comparison of H5ANAG6NAMR-UHC by SK hynix and H5ANAG6NBJR-UHC by SK hynix. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

SK hynix
H5ANAG6NBJR-UHC H5ANAG6NBJR-UHC - 4Gb DDR4 SDRAM x16 | SK Hynix

H5ANAG6NBJR-UHC - 4Gb DDR4 SDRAM x16 | SK Hynix

H5ANAG6NBJR-UHC ✓ Active

Specification Comparison

Parameter H5ANAG6NAMR-UHC H5ANAG6NBJR-UHC
Brand SK hynix SK hynix
Category Memory ICs DRAM
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $4.50 $8.09
Memory Type DDR4 SDRAM DDR4 SDRAM
Memory Density 16 Gbit (2 GB) —
Organization 1G x 16 256M x 16
Speed Grade / Data Rate DDR4-2400 (UHC bin, PC4-19200) —
Supply Voltage (VDD) 1.2 V —
Architecture CMOS DDR4 with bank groups —
Power Class Normal Power —
Package FBGA-96 (PBGA96) PBGA96 / FBGA-96 (TFBGA)
Mounting Type Surface Mount (BGA solder ball) —
Operating Temperature [DATA_NEEDED: operating temperature range] -40C to +95C
Refresh Self-refresh and auto-refresh (DDR4 standard 64 ms) Auto / Self Refresh
CAS Latency [DATA_NEEDED: CL for UHC bin] [DATA_NEEDED: CAS Latency]
Interface Type Parallel, synchronous, double data rate —
Available Speed Bins (family) PB / RD / TF / UH / VK —
Application Class Main memory, embedded, industrial —
RoHS Status [DATA_NEEDED: RoHS status] RoHS Compliant
Lifecycle Status Active production —
Density — 4 Gb
Interface — DDR4 (CMOS)
Package Dimensions — 13 mm length (per JESD-30 R-PBGA-B96)
Access Mode — Multi Bank, Page Burst
Data Mask — Supported (DM function)
Asynchronous Reset — Supported
On-Chip Termination — Dynamic ODT
ZQ Calibration — Supported
Write Leveling — Supported
CRC — Supported
Supply Voltage Class — DDR4 (1.2 V class)
REACH Compliance — Compliant
ECCN — EAR99
HTS Code — 8542.32.00.36
Max Data Rate — [DATA_NEEDED: Max Data Rate]

Datasheets & Resources

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