H5ANAG6NBJR-UHC - 4Gb DDR4 SDRAM x16 | SK Hynix
MPN: H5ANAG6NBJR-UHC ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $9.74 | $9.74 |
| 10 | $9.2 | $92.00 |
| 100 | $8.7 | $870.00 |
| 500 | $8.4 | $4,200.00 |
| 1,000 | $8.09 | $8,090.00 |
Drop-in alternatives for H5ANAG6NBJR-UHC — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
H5ANAG6NBJR-RDC
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$9.6 / Unit
View Datasheet →H5ANAG6NBJR-PBC
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$6.45 / Unit
View Datasheet →H5AN4G6NBJR-UHC
✅ Drop-In✓ In Stock
$8.09 / Unit
View Datasheet →H5AN4G6NBJR-RDC
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$6.15 / Unit
View Datasheet →H5AN4G6NBJR-PBC
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$6.6 / Unit
View Datasheet →K4A4G165WF-BCTD
✅ Drop-In✓ In Stock
$2.69 / Unit
View Datasheet →MT40A256M16LY-083E:B
✅ Drop-In📋 Reference alternative (not in catalog)
H5ANAG6NBJR-UHC Maximum Ratings & Electrical Characteristics
| Memory Type | DDR4 SDRAM |
| Density | 4 Gb |
| Organization | 256M x 16 |
| Interface | DDR4 (CMOS) |
| Package | PBGA96 / FBGA-96 (TFBGA) |
| Package Dimensions | 13 mm length (per JESD-30 R-PBGA-B96) |
| Access Mode | Multi Bank, Page Burst |
| Operating Temperature | -40C to +95C |
| Refresh | Auto / Self Refresh |
| Data Mask | Supported (DM function) |
| Asynchronous Reset | Supported |
| On-Chip Termination | Dynamic ODT |
| ZQ Calibration | Supported |
| Write Leveling | Supported |
| CRC | Supported |
| Supply Voltage Class | DDR4 (1.2 V class) |
| RoHS Status | RoHS Compliant |
| REACH Compliance | Compliant |
| ECCN | EAR99 |
| HTS Code | 8542.32.00.36 |
H5ANAG6NBJR-UHC 13 mm length (per jesd-30 r-pbga-b96) Pin Configuration Guide
Complete pinout information for H5ANAG6NBJR-UHC (13 mm length (per jesd-30 r-pbga-b96) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for H5ANAG6NBJR-UHC.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
H5ANAG6NBJR-UHC is suitable for 6 applications: Embedded Computing Modules, Industrial Automation Controllers, Networking Equipment Line Cards, Replacement and Legacy BOM Sourcing, Test and Measurement Instruments, Medical and Monitoring Equipment.
Embedded Computing Modules
The H5ANAG6NBJR-UHC fits embedded compute modules (COMs, SoM carrier boards, SoC FPGA boards) where a single 4Gb x16 DDR4 device in FBGA-96 supplies the main memory with minimal board area. The 256M x 16 organization pairs naturally with 16-bit memory controllers found in ARM SoCs and Intel/Altera SoC FPGAs such as the 10AS032E4F29E3SG, avoiding the need to bridge two narrower devices. Dynamic ODT, write leveling, and ZQ calibration maintain signal integrity across fly-by topologies at the DDR4 data rates supported by the -UHC bin, while the -40C to +95C range and auto/self-refresh guarantee reliable boot and data retention in fanless enclosures. CRC and asynchronous reset add robustness for always-on edge systems.
Recommended
Industrial Automation Controllers
In PLCs, motion controllers, and factory-edge gateways, the H5ANAG6NBJR-UHC provides main memory that tolerates the harsh -40C to +95C ambient range demanded by industrial cabinets and outdoor equipment. The auto/self-refresh feature protects DRAM content through controller clock glitches, and the asynchronous reset pin lets a supervisor cleanly reset the SDRAM during brown-out events. Its single-device 4Gb x16 footprint simplifies power-tree design: only the 1.2 V DDR4 rails are needed, reducing rail count versus multi-chip solutions. Multi-bank page-burst access delivers the bandwidth needed for log buffering, vision preprocessing, and protocol stacks, while the RoHS/REACH-compliant lead-free package meets industrial environmental requirements.
Recommended
Networking Equipment Line Cards
For switch, router, and access-equipment line cards, the H5ANAG6NBJR-UHC serves as packet-buffer and control-plane memory. The multi-bank, page-burst architecture sustains the random-access patterns typical of queuing and lookup workloads, and CRC support helps detect link-layer corruption in noisy backplane environments. The FBGA-96 body's short ball interconnects minimize stub length compared with larger TSOP legacy packages, easing 2400-2666 Mbps routing. Designers typically pair one device per 16-bit lane on the fly-by command/address bus and rely on dynamic ODT and write leveling to close timing, with the -UHC speed bin chosen where the MAC/NPU memory controller runs at the upper DDR4 operating rates.
Recommended
Replacement and Legacy BOM Sourcing
The H5ANAG6NBJR-UHC is frequently purchased as a replacement part for discontinued or shortage-hit SK Hynix DDR4 line items, because the H5AN4G6NBJR / H5ANAG6NBJR FBGA-96 x16 family is widely cross-listed by distributors such as LCSC, Ampheo, and Win Source. When a legacy controller module needs a like-for-like DRAM, the family's pin-to-pin compatibility across die generations and speed suffixes lets buyers swap without PCB rework. Distributor metadata confirms RoHS compliance, REACH compliance, and stable lifecycle codes (EAR99, HTS 8542.32.00.36), simplifying requalification paperwork. For obsolescence-prone industrial spares inventory, stocking this part covers multiple legacy MPNs at once.
Recommended
Test and Measurement Instruments
Bench instruments, data-acquisition units, and logic analyzers need fast scratch memory for waveform capture and post-processing; the H5ANAG6NBJR-UHC's 4Gb capacity and page-burst multi-bank access support deep capture buffers in a single FBGA-96 footprint. The industrial temperature range suits portable instruments used in the field, and self-refresh allows low-power state retention between measurements, extending battery life in handheld devices. Because x16 organization concentrates memory width in one device, instrument designers can allocate the saved board area to analog front ends. ZQ calibration keeps output impedance accurate over temperature, preserving eye margins on long PCB runs between the DDR4 controller and the memory.
Recommended
Medical and Monitoring Equipment
Patient monitors, imaging preprocessing units, and portable diagnostic devices use the H5ANAG6NBJR-UHC for buffered sensor data and UI frame buffers. The part's low-voltage 1.2 V DDR4 interface reduces total board power compared with DDR3-class memories of the same capacity, an important factor in battery-backed and thermally sealed medical enclosures. The -40C to +95C industrial rating exceeds typical medical indoor requirements, giving conservative thermal derating margin, while auto/self-refresh preserves logged patient data through watchdog resets. The lead-free, halogen-free, RoHS/REACH-compliant package aligns with medical device material restrictions, and the widely documented family datasheet simplifies design-history-file documentation.
Recommended
Recommended Products Summary
Engineering reference data for H5ANAG6NBJR-UHC — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | H5ANAG6NBJR-RDC | H5ANAG6NBJR-PBC | H5AN4G6NBJR-UHC | K4A4G165WF-BCTD | MT40A256M16LY-083E:B |
|---|---|---|---|---|---|---|
| Package | FBGA-96 (PBGA96) | FBGA-96 - same | FBGA-96 - same | FBGA-96 - same | FBGA-96 - same | FBGA-96 - same |
| Brand | SK Hynix | SK Hynix | SK Hynix | SK Hynix | Samsung Electronics | Micron Technology |
| Density | 4 Gb | 4 Gb | 4 Gb | 4 Gb | 4 Gb | 4 Gb |
| Organization | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 |
| Interface | DDR4 (CMOS) | DDR4 | DDR4 | DDR4 | DDR4 | DDR4 |
| Speed Bin | UHC (fastest of the compared bins) | RDC (slower bin) | PBC (slowest bin) | UHC (same bin, prior die) | [DATA_NEEDED] | 083E (2133 Mbps bin) |
| Operating Temperature | -40C to +95C | -40C to +95C | -40C to +95C | -40C to +95C | [DATA_NEEDED] | 0C to +95C (extended variants available) |
| Feature Set (ODT/ZQ/Write Leveling/CRC) | Yes - full set | Yes - full set | Yes - full set | Yes - full set | Yes - full set | Yes - full set |
| RoHS Compliance | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
Key Differentiators
- Fastest speed suffix in the H5ANAG6NBJR family listed on XAIPART (vs H5ANAG6NBJR-RDC)
- Revised A-die generation (vs H5AN4G6NBJR-UHC)
- Industrial temperature range (vs MT40A256M16LY-083E:B)
Design Notes
Route the DDR4 command/address bus in fly-by topology with on-die termination doing the termination work: set ODT values per the controller's MR programming rather than adding discrete VTT terminators, which saves power and board area at 1.2 V. Match DQS strobes to their DQ/DM groups tightly (controller-dependent skew budget, typically a few ps per inch of mismatch tolerance in length units) and reference all DDR4 signals to solid ground planes. Enable write leveling during controller training since the -UHC bin's data rate requires it for reliable write capture.
Connect the ZQ calibration ball to a precision 240-ohm (nominal family value - confirm exact resistor in the SK Hynix datasheet for this die) resistor to ground with a short dedicated trace; do not share this resistor between devices. Provide low-impedance 1.2 V VDD/VDDQ decoupling at the BGA via field - a mix of bulk and 0201/0402 ceramics close to the balls. Fan out DQ/DQS/DM on inner layers between ground planes for controlled impedance (~50 ohm single-ended) and keep stubs on the BGA breakout as short as possible.
Two common mistakes with this family: first, assuming speed-bin suffixes (UHC/RDC/PBC) are interchangeable without controller retraining - each suffix changes the supported CAS latency and AC timing table, so controller timing parameters must be re-derived when substituting a slower bin. Second, mixing die generations (H5AN4G6NBJR non-A vs H5ANAG6NBJR A-die) on the same board without checking the memory controller's qualified vendor list; some controllers certify only one die revision per bus. Always re-run memory training and margin testing at temperature extremes after any substitution.
Compliance Information
RoHS compliant per ICAllIn specification table; REACH compliant; Alldatasheet family description states Lead-Free & Halogen-Free. ECCN EAR99, HTS 8542.32.00.36. Not an automotive AEC-Q100 part.
