H5ANAG6NAMR-UHC vs H5ANAG8NAMR-UHC Comparison
Detailed side-by-side comparison of H5ANAG6NAMR-UHC by SK hynix and H5ANAG8NAMR-UHC by SK hynix. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | H5ANAG6NAMR-UHC | H5ANAG8NAMR-UHC |
|---|---|---|
| Brand | SK hynix | SK hynix |
| Category | Memory ICs | Memory ICs |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $4.50 | $2.15 |
| Memory Type | DDR4 SDRAM | DDR4 SDRAM |
| Memory Density | 16 Gbit (2 GB) | — |
| Organization | 1G x 16 | 2G x 8 |
| Speed Grade / Data Rate | DDR4-2400 (UHC bin, PC4-19200) | — |
| Supply Voltage (VDD) | 1.2 V | — |
| Architecture | CMOS DDR4 with bank groups | — |
| Power Class | Normal Power | — |
| Package | FBGA-96 (PBGA96) | FBGA-78 |
| Mounting Type | Surface Mount (BGA solder ball) | Surface Mount |
| Operating Temperature | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Refresh | Self-refresh and auto-refresh (DDR4 standard 64 ms) | Self-refresh and auto-refresh (DDR4) |
| CAS Latency | [DATA_NEEDED: CL for UHC bin] | — |
| Interface Type | Parallel, synchronous, double data rate | — |
| Available Speed Bins (family) | PB / RD / TF / UH / VK | — |
| Application Class | Main memory, embedded, industrial | — |
| RoHS Status | [DATA_NEEDED: RoHS status] | Compliant (lead-free FBGA package) |
| Lifecycle Status | Active production | — |
| Manufacturer | — | SK Hynix |
| Density | — | 16 Gbit |
| Data Rate | — | DDR4-2400 (2400 MT/s) |
| Supply Voltage | — | 1.2 V |
| Interface | — | Parallel, DDR4 |
| Bank Group Architecture | — | DDR4 bank-group architecture |
| On-Die Termination (ODT) | — | Yes |
| MSL Level | — | [DATA_NEEDED: moisture sensitivity level] |
| Applications | — | Data storage, firmware boot, industrial controllers, computing modules |