H5ANAG8NCMR-VKC vs H5ANAG8NCJR-XNC Comparison

Detailed side-by-side comparison of H5ANAG8NCMR-VKC by SK hynix and H5ANAG8NCJR-XNC by SK hynix. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

SK hynix
H5ANAG8NCMR-VKC H5ANAG8NCMR-VKC - 16Gb DDR4-2666 x8 DRAM FBGA | SK hynix

H5ANAG8NCMR-VKC - 16Gb DDR4-2666 x8 DRAM FBGA | SK hynix

H5ANAG8NCMR-VKC ✓ Active
SK hynix
H5ANAG8NCJR-XNC H5ANAG8NCJR-XNC - 16Gb DDR4-3200 SDRAM 2Gx8 | SK Hynix

H5ANAG8NCJR-XNC - 16Gb DDR4-3200 SDRAM 2Gx8 | SK Hynix

H5ANAG8NCJR-XNC ✓ Active

Specification Comparison

Parameter H5ANAG8NCMR-VKC H5ANAG8NCJR-XNC
Brand SK hynix SK hynix
Category Memory ICs Memory ICs
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $8.05 $65.63
Memory Type DDR4 SDRAM DDR4 SDRAM
Memory Size 16 Gb —
Memory Organization 2G x 8 —
Data Rate 2666 Mbps/pin (DDR4-2666) 3200 MT/s (DDR4-3200)
Supply Voltage (VDD) 1.2 V 1.2 V
I/O Voltage (VDDQ) 1.2 V —
Package FBGA-78 FBGA-78 (7.5 x 11 mm)
Mounting Type Surface Mount Surface Mount
Speed Grade VK (per SK hynix speed-bin suffix) —
Power Class Normal Power —
Bank Groups 4 —
Banks Total 16 —
Operating Temperature [DATA_NEEDED: operating temperature range] 0C to +95C
CAS Latency [DATA_NEEDED: CAS latency for VK speed bin] —
RoHS Status [DATA_NEEDED: RoHS status] Compliant
Packaging [DATA_NEEDED: standard packing quantity] —
Manufacturer Process CMOS DRAM —
Density — 16 Gbit
Organization — 2G x 8
Process Node — 1z nm (non-EUV)
Die Bit Density — 0.296 Gb/mm2
Peak Bandwidth (per 64-bit channel) — 25.6 GB/s at DDR4-3200
CAS Latency (CL) — [DATA_NEEDED: CAS Latency]
Refresh — [DATA_NEEDED: refresh specification]
Base Part Number Family — H5ANAG8NCJR (16Gb DDR4 CMOS SDRAM)
Speed Grade Suffix — -XNC (0~95C commercial)

Datasheets & Resources

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