H5CG34MEBDX030 vs H5CG34MEBDX030N Comparison
Detailed side-by-side comparison of H5CG34MEBDX030 by SK hynix and H5CG34MEBDX030N by SK hynix. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
SK hynix
H5CG34MEBDX030N - DDR5 16Gb SDRAM Component | SK hynix | Server Memory
H5CG34MEBDX030N ✓ ActiveSpecification Comparison
| Parameter | H5CG34MEBDX030 | H5CG34MEBDX030N |
|---|---|---|
| Brand | SK hynix | SK hynix |
| Category | DRAM | DDR5 |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $5.75 | $4.42 |
| Manufacturer | SK hynix | SK hynix |
| Product Family | H5CG (DDR5 SDRAM) | — |
| Memory Type | DDR5 SDRAM | — |
| Density | [DATA_NEEDED: device density (Gb)] | 16 Gbit (2 GB) |
| Organization | [DATA_NEEDED: x organization] | x8 or x16 configuration [DATA_NEEDED: exact bus width] |
| Speed Grade / Data Rate | [DATA_NEEDED: MT/s speed bin] | — |
| CAS Latency (CL) | [DATA_NEEDED: CL value] | — |
| Supply Voltage VDD | [DATA_NEEDED: VDD (typ. 1.1 V class for DDR5)] | — |
| Package | FBGA (fine-pitch BGA), surface mount | — |
| Mounting Type | Surface Mount | — |
| Operating Temperature | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: commercial/industrial range] |
| On-die ECC | Yes (DDR5 standard feature) | — |
| Burst Length | 16 (DDR5 standard) | — |
| Bank Groups | [DATA_NEEDED: bank group count] | — |
| Interface Type | Parallel, DDR5 point-to-point | — |
| RoHS Status | Compliant | — |
| MSL Level | [DATA_NEEDED: moisture sensitivity level] | — |
| Product Type | — | DDR5 SDRAM Component |
| Memory Series | — | H5CG3 series (B-die) |
| DRAM Process Node | — | 1b-nanometer-class |
| Supply Voltage VDD/VDDQ | — | 1.1 V |
| Wordline Boost Supply VPP | — | 1.8 V |
| Interface | — | DDR5 (JEDEC double data rate 5) |
| Data Rate Class | — | [DATA_NEEDED: speed grade per -030 suffix] |
| On-Die ECC | — | Yes (DDR5 ODECC) |
| Sub-Channel Architecture | — | Dual independent 32/40-bit sub-channels |
| Package Type | — | FBGA surface mount |
| ECC Feature | — | On-die ECC, no host overhead |
| Typical Application | — | Server RDIMM / LRDIMM components |