H5CG34MEBDX030 vs H5CG34MEBDX030N Comparación
Comparación detallada lado a lado de H5CG34MEBDX030 por SK hynix y H5CG34MEBDX030N por SK hynix. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
SK hynix
H5CG34MEBDX030N - DDR5 16Gb SDRAM Component | SK hynix | Server Memory
H5CG34MEBDX030N ✓ ActivoComparación de especificaciones
| Parámetro | H5CG34MEBDX030 | H5CG34MEBDX030N |
|---|---|---|
| Marca | SK hynix | SK hynix |
| Categoría | DRAM | DDR5 |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $5,75 | $4,42 |
| Manufacturer | SK hynix | SK hynix |
| Product Family | H5CG (DDR5 SDRAM) | — |
| Tipo de memoria | DDR5 SDRAM | — |
| Density | [DATA_NEEDED: device density (Gb)] | 16 Gbit (2 GB) |
| Organización de memoria | [DATA_NEEDED: x organization] | x8 or x16 configuration [DATA_NEEDED: exact bus width] |
| Speed Grade / Data Rate | [DATA_NEEDED: MT/s speed bin] | — |
| CAS Latency (CL) | [DATA_NEEDED: CL value] | — |
| Supply Voltage VDD | [DATA_NEEDED: VDD (typ. 1.1 V class for DDR5)] | — |
| Encapsulado | FBGA (fine-pitch BGA), surface mount | — |
| Tipo de montaje | Surface Mount | — |
| Temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: commercial/industrial range] |
| On-die ECC | Yes (DDR5 standard feature) | — |
| Burst Length | 16 (DDR5 standard) | — |
| Bank Groups | [DATA_NEEDED: bank group count] | — |
| Tipo de interfaz | Parallel, DDR5 point-to-point | — |
| Estado RoHS | Compliant | — |
| Nivel MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| Product Type | — | DDR5 SDRAM Component |
| Memory Series | — | H5CG3 series (B-die) |
| DRAM Process Node | — | 1b-nanometer-class |
| Supply Voltage VDD/VDDQ | — | 1.1 V |
| Wordline Boost Supply VPP | — | 1.8 V |
| Interfaz | — | DDR5 (JEDEC double data rate 5) |
| Data Rate Class | — | [DATA_NEEDED: speed grade per -030 suffix] |
| On-Die ECC | — | Yes (DDR5 ODECC) |
| Sub-Channel Architecture | — | Dual independent 32/40-bit sub-channels |
| Package Type | — | FBGA surface mount |
| ECC Feature | — | On-die ECC, no host overhead |
| Typical Application | — | Server RDIMM / LRDIMM components |