H5CG34MEBDX030 vs H5CG34MEBDX030N Vergleich
Detaillierter Direktvergleich von H5CG34MEBDX030 von SK hynix und H5CG34MEBDX030N von SK hynix. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
SK hynix
H5CG34MEBDX030N - DDR5 16Gb SDRAM Component | SK hynix | Server Memory
H5CG34MEBDX030N ✓ AktivSpezifikationsvergleich
| Parameter | H5CG34MEBDX030 | H5CG34MEBDX030N |
|---|---|---|
| Marke | SK hynix | SK hynix |
| Kategorie | DRAM | DDR5 |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $5,75 | $4,42 |
| Manufacturer | SK hynix | SK hynix |
| Product Family | H5CG (DDR5 SDRAM) | — |
| Speichertyp | DDR5 SDRAM | — |
| Density | [DATA_NEEDED: device density (Gb)] | 16 Gbit (2 GB) |
| Speicherorganisation | [DATA_NEEDED: x organization] | x8 or x16 configuration [DATA_NEEDED: exact bus width] |
| Speed Grade / Data Rate | [DATA_NEEDED: MT/s speed bin] | — |
| CAS Latency (CL) | [DATA_NEEDED: CL value] | — |
| Supply Voltage VDD | [DATA_NEEDED: VDD (typ. 1.1 V class for DDR5)] | — |
| Gehäuse | FBGA (fine-pitch BGA), surface mount | — |
| Montageart | Surface Mount | — |
| Betriebstemperatur | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: commercial/industrial range] |
| On-die ECC | Yes (DDR5 standard feature) | — |
| Burst Length | 16 (DDR5 standard) | — |
| Bank Groups | [DATA_NEEDED: bank group count] | — |
| Schnittstellentyp | Parallel, DDR5 point-to-point | — |
| RoHS-Status | Compliant | — |
| MSL-Level | [DATA_NEEDED: moisture sensitivity level] | — |
| Product Type | — | DDR5 SDRAM Component |
| Memory Series | — | H5CG3 series (B-die) |
| DRAM Process Node | — | 1b-nanometer-class |
| Supply Voltage VDD/VDDQ | — | 1.1 V |
| Wordline Boost Supply VPP | — | 1.8 V |
| Schnittstelle | — | DDR5 (JEDEC double data rate 5) |
| Data Rate Class | — | [DATA_NEEDED: speed grade per -030 suffix] |
| On-Die ECC | — | Yes (DDR5 ODECC) |
| Sub-Channel Architecture | — | Dual independent 32/40-bit sub-channels |
| Package Type | — | FBGA surface mount |
| ECC Feature | — | On-die ECC, no host overhead |
| Typical Application | — | Server RDIMM / LRDIMM components |