K4A4G165WD-BCRC vs K4A4G165WF-BCRC Comparison
Detailed side-by-side comparison of K4A4G165WD-BCRC by Samsung Electronics and K4A4G165WF-BCRC by Samsung Electronics. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Samsung Electronics
K4A4G165WF-BCRC - 4Gb DDR4-2400 SDRAM | Samsung Electronics
K4A4G165WF-BCRC ✓ ActiveSpecification Comparison
| Parameter | K4A4G165WD-BCRC | K4A4G165WF-BCRC |
|---|---|---|
| Brand | Samsung Electronics | Samsung Electronics |
| Category | Memory ICs | DRAM |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $5.10 | $17.08 |
| Memory Type | DDR4 SDRAM | DDR4 SDRAM |
| Density | 4 Gbit | 4 Gb |
| Organization | 256M x 16 | 256M x 16 |
| Speed Bin | DDR4-2400 (BCRC) | — |
| Supply Voltage | 1.2 V | 1.2 V |
| Package | FBGA-96 | FBGA-96 (TFBGA) |
| Mounting Type | Surface Mount | Surface Mount |
| Process Generation | Samsung D-die | — |
| Interface Type | DDR4 (double data rate, parallel) | — |
| On-Die Termination (ODT) | Yes | — |
| Data Mask Function | Yes | — |
| Auto Precharge | Yes | Supported |
| CRC Function | Yes | — |
| ZQ Calibration | Yes | Supported |
| Operating Temperature | [DATA_NEEDED: operating temperature range] | 0C to +95C |
| RoHS Status | Lead free / RoHS Compliant | Compliant |
| Package Dimensions | [DATA_NEEDED: package dimensions] | — |
| Speed Grade | — | DDR4-2400 |
| Operating Voltage Range | — | 1.14 V to 1.26 V |
| Die Type | — | Samsung 4Gb F-die |
| Bank / Bank Group Architecture | — | 8 banks, bank groups |
| Data Mask | — | Supported (DM) |
| CRC / CA Parity | — | Supported |
| Dynamic ODT | — | Supported |
| Asynchronous Reset | — | Supported |