K4A4G165WF-BCRC vs K4A4G165WD-BCRC Comparison
Detailed side-by-side comparison of K4A4G165WF-BCRC by Samsung Electronics and K4A4G165WD-BCRC by Samsung Electronics. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Samsung Electronics
K4A4G165WF-BCRC - 4Gb DDR4-2400 SDRAM | Samsung Electronics
K4A4G165WF-BCRC ✓ Active
Specification Comparison
| Parameter | K4A4G165WF-BCRC | K4A4G165WD-BCRC |
|---|---|---|
| Brand | Samsung Electronics | Samsung Electronics |
| Category | DRAM | Memory ICs |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $17.08 | $5.10 |
| Memory Type | DDR4 SDRAM | DDR4 SDRAM |
| Density | 4 Gb | 4 Gbit |
| Organization | 256M x 16 | 256M x 16 |
| Speed Grade | DDR4-2400 | — |
| Supply Voltage | 1.2 V | 1.2 V |
| Operating Voltage Range | 1.14 V to 1.26 V | — |
| Package | FBGA-96 (TFBGA) | FBGA-96 |
| Die Type | Samsung 4Gb F-die | — |
| Bank / Bank Group Architecture | 8 banks, bank groups | — |
| Data Mask | Supported (DM) | — |
| CRC / CA Parity | Supported | — |
| ZQ Calibration | Supported | Yes |
| Dynamic ODT | Supported | — |
| Auto Precharge | Supported | Yes |
| Asynchronous Reset | Supported | — |
| Operating Temperature | 0C to +95C | [DATA_NEEDED: operating temperature range] |
| Mounting Type | Surface Mount | Surface Mount |
| RoHS Status | Compliant | Lead free / RoHS Compliant |
| Speed Bin | — | DDR4-2400 (BCRC) |
| Process Generation | — | Samsung D-die |
| Interface Type | — | DDR4 (double data rate, parallel) |
| On-Die Termination (ODT) | — | Yes |
| Data Mask Function | — | Yes |
| CRC Function | — | Yes |
| Package Dimensions | — | [DATA_NEEDED: package dimensions] |