K4A8G085WB-BIWE vs MT40A1G8SA-075:E Comparison

Detailed side-by-side comparison of K4A8G085WB-BIWE by Samsung Electronics and MT40A1G8SA-075:E by Micron Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Samsung Electronics
K4A8G085WB-BIWE K4A8G085WB-BIWE - 8Gb DDR4 SDRAM 3200Mbps | Samsung

K4A8G085WB-BIWE - 8Gb DDR4 SDRAM 3200Mbps | Samsung

K4A8G085WB-BIWE ✓ Active
Micron Technology
MT40A1G8SA-075:E MT40A1G8SA-075:E - 8Gb DDR4 SDRAM 1.33GHz | Micron

MT40A1G8SA-075:E - 8Gb DDR4 SDRAM 1.33GHz | Micron

MT40A1G8SA-075:E ✓ Active

Specification Comparison

Parameter K4A8G085WB-BIWE MT40A1G8SA-075:E
Brand Samsung Electronics Micron Technology
Category Memory ICs Memory ICs
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $6.50 $6.30
Memory Type DDR4 SDRAM SDRAM - DDR4
Memory Size 8 Gb 8Gbit (1G x 8)
Memory Organization 1G x 8 —
Data Rate 3200 Mbps 2666 MT/s
Supply Voltage 1.2 V —
Operating Temperature 0°C to +85°C —
Package 78-FBGA 78-FBGA (7.5x11 mm)
Mounting Type Surface Mount Surface Mount
Memory Interface Parallel —
Access Time [DATA_NEEDED: tRCD, tRP, tRAS] —
CAS Latency [DATA_NEEDED: CL value] —
Refresh Auto-refresh, self-refresh —
RoHS Status Compliant Compliant
Lead-Free Yes —
Halogen Free Yes —
Interface — Parallel
Clock Frequency — 1.33 GHz
Supply Voltage (VDD/VDDQ) — 1.2V ±60mV
VPP Supply Voltage — 2.5V (-125mV, +250mV)
Operating Temperature Range — 0°C to +95°C
Refresh Time — 64ms at -40°C to 85°C, 32ms at >85°C to 95°C, 16ms at >95°C to 105°C
Write Leveling — Supported
Dynamic On-Chip Termination — Supported
CRC Function — Supported
Data Mask Function — Supported

Datasheets & Resources

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