K4AAG165WA-BCTD vs K4AAG165WM-BCRC Comparison
Detailed side-by-side comparison of K4AAG165WA-BCTD by Samsung Electronics and K4AAG165WM-BCRC by Samsung Electronics. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Samsung Electronics
K4AAG165WM-BCRC - 16Gb DDR4 x16 SDRAM 3200Mbps | Samsung
K4AAG165WM-BCRC ✓ ActiveSpecification Comparison
| Parameter | K4AAG165WA-BCTD | K4AAG165WM-BCRC |
|---|---|---|
| Brand | Samsung Electronics | Samsung Electronics |
| Category | Memory ICs | Memory ICs |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $60.59 | $22.60 |
| Memory Type | DDR4 SDRAM | DDR4 SDRAM |
| Memory Size | 16 Gb | — |
| Memory Organization | 1G x 16 | — |
| Data Rate | 2666 Mbps | 3200 Mbps |
| Supply Voltage | 1.2 V | — |
| Interface | Synchronous, DDR4 | DDR4 (SSTL-12) |
| Operating Temperature | 0C to +85C | [DATA_NEEDED: operating temperature range for K4AAG165WM-BCRC] |
| Package | 96-FBGA | 96-ball FBGA |
| Mounting Type | Surface Mount | Surface Mount |
| Memory Format | Volatile (DRAM) | — |
| Bank Architecture | DDR4 bank-group architecture | — |
| Technology Family | DDR4 SDRAM (Samsung K4AAG165WA series) | — |
| Application Class | Computing, embedded, consumer main memory | — |
| Package Family | FBGA -> fine-pitch BGA -> surface mount | — |
| Temperature Grade | Commercial (0C to +85C) | — |
| RoHS Status | [DATA_NEEDED: RoHS status] | Compliant |
| MSL Level | [DATA_NEEDED: moisture sensitivity level] | — |
| Density | — | 16 Gb |
| Organization | — | 1G x 16 |
| Supply Voltage (VDD) | — | 1.2 V |
| Auto Precharge | — | Yes |
| Asynchronous Reset | — | Yes |
| CRC Function | — | Yes |
| ZQ Calibration | — | Yes |
| Dynamic On-Chip Termination | — | Yes |
| Data Mask Function | — | Yes |
| CAS Latency (CL) | — | [DATA_NEEDED: CAS latency at 3200 Mbps] |