K4AAG165WA-BCTD vs K4AAG165WM-BCRC Vergleich
Detaillierter Direktvergleich von K4AAG165WA-BCTD von Samsung Electronics und K4AAG165WM-BCRC von Samsung Electronics. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Samsung Electronics
K4AAG165WM-BCRC - 16Gb DDR4 x16 SDRAM 3200Mbps | Samsung
K4AAG165WM-BCRC ✓ AktivSpezifikationsvergleich
| Parameter | K4AAG165WA-BCTD | K4AAG165WM-BCRC |
|---|---|---|
| Marke | Samsung Electronics | Samsung Electronics |
| Kategorie | Memory ICs | Memory ICs |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $60,59 | $22,60 |
| Speichertyp | DDR4 SDRAM | DDR4 SDRAM |
| Speichergröße | 16 Gb | — |
| Memory Organization | 1G x 16 | — |
| Datenrate | 2666 Mbps | 3200 Mbps |
| Versorgungsspannung | 1.2 V | — |
| Schnittstelle | Synchronous, DDR4 | DDR4 (SSTL-12) |
| Betriebstemperatur | 0C to +85C | [DATA_NEEDED: operating temperature range for K4AAG165WM-BCRC] |
| Gehäuse | 96-FBGA | 96-ball FBGA |
| Montageart | Surface Mount | Surface Mount |
| Memory Format | Volatile (DRAM) | — |
| Bank Architecture | DDR4 bank-group architecture | — |
| Technology Family | DDR4 SDRAM (Samsung K4AAG165WA series) | — |
| Application Class | Computing, embedded, consumer main memory | — |
| Package Family | FBGA -> fine-pitch BGA -> surface mount | — |
| Temperature Grade | Commercial (0C to +85C) | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | Compliant |
| MSL-Level | [DATA_NEEDED: moisture sensitivity level] | — |
| Density | — | 16 Gb |
| Speicherorganisation | — | 1G x 16 |
| Supply Voltage (VDD) | — | 1.2 V |
| Auto Precharge | — | Yes |
| Asynchronous Reset | — | Yes |
| CRC Function | — | Yes |
| ZQ Calibration | — | Yes |
| Dynamic On-Chip Termination | — | Yes |
| Data Mask Function | — | Yes |
| CAS Latency (CL) | — | [DATA_NEEDED: CAS latency at 3200 Mbps] |