K4AAG165WM-BCWE vs K4AAG165WA-BCWE Comparison
Detailed side-by-side comparison of K4AAG165WM-BCWE by Samsung Electronics and K4AAG165WA-BCWE by Samsung Electronics. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | K4AAG165WM-BCWE | K4AAG165WA-BCWE |
|---|---|---|
| Brand | Samsung Electronics | Samsung Electronics |
| Category | DRAM | Memory ICs |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $54.65 | $62.40 |
| Memory Type | DDR4 SDRAM | DDR4 SDRAM |
| Density | 16 Gbit | — |
| Organization | 256M x 16 (1G x 16) | — |
| Data Rate | 3200 Mbps | 3200 Mbps (DDR4-3200) |
| Interface | Parallel (DDR4) | — |
| Supply Voltage VDD | 1.2 V | — |
| Supply Voltage VDDQ | 1.2 V | — |
| Access Time (Clock Cycle Time) | [DATA_NEEDED: tCK for BCWE bin] | — |
| CAS Latency | [DATA_NEEDED: CL at 3200 Mbps] | — |
| Bank Groups | 4 (x16 configuration) | — |
| Burst Length | 8 | — |
| Package | 78-ball FBGA | 96-ball FBGA |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | [DATA_NEEDED: temperature range for WM-BCWE] | -40C to +95C |
| Die Revision | W (WM suffix) | — |
| RoHS Status | Compliant | Compliant |
| Operating Frequency | 1600 MHz (DDR, 3200 Mbps) | — |
| Memory Size | — | 16 Gb (2 GB) |
| Memory Organization | — | 1G x 16 |
| Supply Voltage | — | 1.2 V |
| Package Dimensions | — | 13 x 9 mm |
| Ball Pitch | — | 0.8 mm |
| Interface Type | — | Parallel, DDR4 |
| Memory Format | — | DRAM (Volatile) |
| Technology | — | DDR4 SDRAM, 8n prefetch, bank group architecture |
| Packaging | — | Tray |
| Product Status | — | Active |